MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 464

• Manufacturer Part Number: MC9S12XET256MAL
• Description: MCU 16BIT 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XET256MAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 91
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• On-chip Adc: 16-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 10 XGATE (S12XGATEV3)
464
Branches
Load and Store Instructions
Bit Field Instructions
Logic Immediate Instructions
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
BCC REL9
BCS REL9
BNE REL9
BEQ REL9
BPL REL9
BMI REL9
BVC REL9
BVS REL9
BHI REL9
BLS REL9
BGE REL9
BLT REL9
BGT REL9
BLE REL9
BRA REL10
LDB RD, (RB, #OFFS5)
LDW RD, (RB, #OFFS5)
STB RS, (RB, #OFFS5)
STW RS, (RB, #OFFS5)
LDB RD, (RB, RI)
LDW RD, (RB, RI)
STB RS, (RB, RI)
STW RS, (RB, RI)
LDB RD, (RB, RI+)
LDW RD, (RB, RI+)
STB RS, (RB, RI+)
STW RS, (RB, RI+)
LDB RD, (RB, –RI)
LDW RD, (RB, –RI)
STB RS, (RB, –RI)
STW RS, (RB, –RI)
BFEXT RD, RS1, RS2
BFINS RD, RS1, RS2
BFINSI RD, RS1, RS2
BFINSX RD, RS1, RS2
ANDL RD, #IMM8
ANDH RD, #IMM8
BITL RD, #IMM8
BITH RD, #IMM8
ORL RD, #IMM8
ORH RD, #IMM8
XNORL RD, #IMM8
XNORH RD, #IMM8
Functionality
Table 10-24. Instruction Set Summary (Sheet 2 of 3)
MC9S12XE-Family Reference Manual , Rev. 1.23
15
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
14
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
13
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
12
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
11
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
10
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RD
RS
RS
RS
RS
RS
RS
RS
RS
9
0
1
0
1
0
1
0
1
0
1
0
1
0
1
8
7
RS1
RS1
RS1
RS1
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
6
REL10
5
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
Freescale Semiconductor
4
IMM8
IMM8
IMM8
IMM8
IMM8
IMM8
IMM8
IMM8
RS2
RS2
RS2
RS2
RI
RI
RI
RI
RI
RI
RI
RI
RI
RI
RI
RI
3
OFFS5
OFFS5
OFFS5
OFFS5
2
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1