MC908GR4CDWE Freescale Semiconductor, MC908GR4CDWE Datasheet - Page 388

• Manufacturer Part Number: MC908GR4CDWE
• Description: IC MCU 4K FLASH 8MHZ 28-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC908GR4CDWE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number Of I /o: 17
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 384 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: HC08
• No. Of I/o's: 21
• Ram Memory Size: 384Byte
• Cpu Speed: 8MHz
• No. Of Timers: 1
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Processor Series: HC08GR
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 384 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8.2 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, DEMO908GZ60E, M68CBL05CE, M68EML08GPGTE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 6 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Mechanical Specifications
24.3 32-Pin LQFP (Case #873A)
Technical Data
388
C E
B
Seating
plane
- T -
9
B1
H
-AB-
-AC-
1
8
8x
M
DETAIL AD
32
9
S1
W
A1
A
S
X
DETAIL Y
Freescale Semiconductor, Inc.
K
- Z -
G
For More Information On This Product,
R
25
Q
0.10 (0.004) AC
4X
17
Go to: www.freescale.com
4X
Mechanical Specifications
0.20 (0.008) AB T-U Z
- U -
0.20 (0.008) AC T-U Z
V1
F
Section AE–AE
Base Metal
V
DETAIL AD
N
J
D
NOTES:
1. DIMENSIONS AND TOLERANCING AS PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER MAY VARY
Y14.5M, 1982
LEAD AND IS CONSISTENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE
DATUM PLANE -AB-
SEATING PLANE -AC-
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -AB-
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020)
0.0076 (0.0003)
FROM DEPICTION
P
DIM
A1
B1
S1
V1
W
A
B
C
D
E
F
G
H
K
M
N
P
Q
R
S
V
X
J
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MIN
MILLIMETERS
1
MC68HC908GR8 — Rev 4.0
DETAIL Y
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
12 REF
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
AE
AE
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
1
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
INCHES
12 REF
MOTOROLA
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
MAX
5