MC9S08RD32PE Freescale Semiconductor, MC9S08RD32PE Datasheet - Page 214

IC MCU 32K FLASH 2K RAM 28-DIP

MC9S08RD32PE

Manufacturer Part Number
MC9S08RD32PE
Description
IC MCU 32K FLASH 2K RAM 28-DIP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08RD32PE

Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
28-DIP (0.600", 15.24mm)
Processor Series
S08RD
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
39
Number Of Timers
2
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08RG60E
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08RD32PE
Manufacturer:
Freescale Semiconductor
Quantity:
135
Electrical Characteristics
A.9.3
Table A-11
214
and
SPI Timing
External clock frequency
External clock period
External clock high time
External clock low time
Input capture pulse width
Figure A-11
TPM1CHn
Function
through
TPM1CHn
TPM1CHn
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
Figure A-10. Timer Input Capture Pulse
Figure A-9. Timer External Clock
Figure A-14
Table A-10. TPM Input Timing
t
clkh
Symbol
f
t
describe the timing requirements for the SPI system.
TPMext
TPMext
t
ICPW
t
t
t
t
clkh
clkl
ICPW
ICPW
t
Text
t
clkl
Min
1.5
1.5
1.5
dc
4
f
Max
Bus
/4
Freescale Semiconductor
MHz
Unit
t
t
t
t
cyc
cyc
cyc
cyc

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