MC9S08RD32PE Freescale Semiconductor, MC9S08RD32PE Datasheet - Page 16

IC MCU 32K FLASH 2K RAM 28-DIP

MC9S08RD32PE

Manufacturer Part Number
MC9S08RD32PE
Description
IC MCU 32K FLASH 2K RAM 28-DIP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08RD32PE

Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
28-DIP (0.600", 15.24mm)
Processor Series
S08RD
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
39
Number Of Timers
2
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08RG60E
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08RD32PE
Manufacturer:
Freescale Semiconductor
Quantity:
135
Introduction
1.2.1
Table 1-1
functions and configuration among them.
16
Keyboard Interrupt Ports
Carrier Modulator Timer
Development Support
1. Available only in 32-, 44-, and 48-pin LQFP packages.
9S08RG32/60
9S08RE8/16/32/60
9S08RD8/16/32/60
System Protection
Timer/Pulse-Width
Modulator (TPM1)
Package Options
lists the devices available in the MC9S08RD/RE/RG series and summarizes the differences in
Devices in the MC9S08RD/RE/RG Series
Device
(KBI1, KBI2)
Port Pins
(CMT)
Table 1-1. Devices in the MC9S08RD/RE/RG Series
• 2-channel, 16-bit timer/pulse-width modulator (TPM1) module that can operate as a
• Selectable input capture, output compare, and edge-aligned or center-aligned PWM
• Providing 12 keyboard interrupts
• Eight with falling-edge/low-level plus four with selectable polarity
• KBI1 inputs can be configured for edge-only sensitivity or edge-and-level sensitivity
• Drives IRO pin for remote control communications
• Can be disconnected from IRO pin and used as output compare timer
• IRO output pin has high-current sink capability
• Background debugging system (see also the
• Breakpoint capability to allow single breakpoint setting during in-circuit debugging (plus
• Debug module containing two comparators and nine trigger modes. Eight deep FIFO
• Eight high-current pins (limited by maximum package dissipation)
• Software selectable pullups on ports when used as input. Selection is on an individual
• 39 general-purpose input/output (I/O) pins, depending on package selection
• 28-pin plastic dual in-line package (PDIP)
• 28-pin small outline integrated circuit (SOIC)
• 32-pin low-profile quad flat package (LQFP)
• 44-pin low-profile quad flat package (LQFP)
• 48-pin quad flat package (QFN)
• Optional computer operating properly (COP) reset
• Low-voltage detection with reset or interrupt
• Illegal opcode detection with reset
• Illegal address detection with reset (some devices don’t have illegal addresses)
8/16K/32K/60K
8/16K/32K/60K
free-running counter, a modulo counter, or an up-/down-counter when the TPM is
configured for center-aligned PWM
capability on each channel
two more breakpoints in on-chip debug module)
for storing change-of-flow addresses and event-only data. Debug module supports
both tag and force breakpoints.
port bit basis. During output mode, pullups are disengaged.
Dedicated infrared output (IRO) pin
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
32K/60K
FLASH
1K/1K/2K/2K
1K/1K/2K/2K
2K/2K
RAM
ACMP
Yes
Yes
No
Development Support
(1)
SCI
Yes
Yes
Yes
Freescale Semiconductor
chapter)
SPI
Yes
No
No

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