S9S08SG16E1VTJ Freescale Semiconductor, S9S08SG16E1VTJ Datasheet - Page 28
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S9S08SG16E1VTJ
Manufacturer Part Number
S9S08SG16E1VTJ
Description
MCU 16K FLASH 20-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.S9S08SG16E1CTG.pdf
(330 pages)
Specifications of S9S08SG16E1VTJ
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
20-TSSOP
Processor Series
S08SG
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SPI, SCI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
22
Number Of Timers
2
Operating Supply Voltage
- 0.3 V to + 5.8 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
On-chip Dac
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
S9S08SG16E1VTJ SG16SVTJ
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
S9S08SG16E1VTJR
Manufacturer:
FREESCALE
Quantity:
20 000
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Chapter 2 Pins and Connections
Typically, application systems have two separate capacitors across the power pins. In this case, there
should be a bulk electrolytic capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage
for the overall system and a 0.1-μF ceramic bypass capacitor located as near to the MCU power pins as
practical to suppress high-frequency noise. Each pin must have a bypass capacitor for best noise
suppression.
V
ADC module. A 0.1 μF ceramic bypass capacitor should be located as near to the MCU power pins as
practical to suppress high-frequency noise. The V
voltage reference low inputs, respectively for the ADC module. For this MCU, V
pin and these pins are available only in the 28-pin packages. In the 16-pin and 20-pin packages, they are
double bonded to the V
in the 28-pin packages. In the 16-pin and 20-pin packages, they are double bonded to the V
2.2.2
Immediately after reset, the MCU uses an internally generated clock provided by the clock source
generator (ICS) module. For more information on the ICS, see
(S08ICSV2).”
The oscillator (XOSC) in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic
resonator. Rather than a crystal or ceramic resonator, an external oscillator can be connected to the EXTAL
input pin.
Refer to
resistors such as carbon composition resistors. Wire-wound resistors, and some metal film resistors, have
too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically
designed for high-frequency applications.
R
is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to humidity and
lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when selecting C1 and C2. The crystal manufacturer typically specifies a load capacitance
which is the series combination of C1 and C2 (which are usually the same size). As a first-order
approximation, use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin
(EXTAL and XTAL).
2.2.3
RESET is a dedicated pin with open-drain drive containing an internal pull-up device. Internal power-on
reset and low-voltage reset circuitry typically make external reset circuitry unnecessary. This pin is
normally connected to the standard 6-pin background debug connector so a development system can
directly reset the MCU system. If desired, a manual external reset can be added by supplying a simple
switch to ground (pull reset pin low to force a reset).
28
F
DDA
is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup; its value
and V
Figure 2-4
Oscillator (XOSC)
RESET
SSA
are the analog power supply pins for MCU. This voltage source supplies power to the
for the following discussion. R
DD
pin. For this MCU, V
MC9S08SG32 Data Sheet, Rev. 8
SSA
REFH
S
shares the V
(when used) and R
and V
REFL
Chapter 11, “Internal Clock Source
REFL
pins are the voltage reference high and
pin and these pins are available only
F
should be low-inductance
DDA
Freescale Semiconductor
shares the V
SS
pin.
REFH
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