STM32F103ZCT6 STMicroelectronics, STM32F103ZCT6 Datasheet - Page 106
STM32F103ZCT6
Manufacturer Part Number
STM32F103ZCT6
Description
MCU ARM 32BIT 256K FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F103ZCT6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Controller Family/series
(ARM Cortex) STM32
No. Of I/o's
112
Ram Memory Size
32KB
Cpu Speed
72MHz
No. Of Timers
8
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Interface Type
CAN/I2C/SPI/USART
Total Internal Ram Size
48KB
# I/os (max)
112
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
On-chip Adc
3(21-chx12-bit)
On-chip Dac
2(2-chx12-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103ZCT6
Manufacturer:
STMicroelectronics
Quantity:
20 000
Company:
Part Number:
STM32F103ZCT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103ZCT6
Manufacturer:
ST
Quantity:
20 000
Electrical characteristics
106/130
Figure 58. Typical connection diagram using the ADC
1. Refer to
2. C
General PCB design guidelines
Power supply decoupling should be performed as shown in
depending on whether V
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 59. Power supply and reference decoupling (V
1. V
pad capacitance (roughly 7 pF). A high C
this, f
REF+
parasitic
ADC
V AIN
and V
Table 59
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
should be reduced.
R AIN (1)
REF–
1 µF // 10 nF
for the values of R
inputs are available only on 100-pin packages.
C parasitic
AINx
REF+
is connected to V
Doc ID 14611 Rev 8
AIN
V DD
1 µF // 10 nF
, R
parasitic
ADC
0.6 V
0.6 V
V T
V T
and C
value will downgrade conversion accuracy. To remedy
STM32F103xC, STM32F103xD, STM32F103xE
ADC
I L ±1 µA
DDA
.
or not. The 10 nF capacitors should be
V
V
STM32F103xx
V
(see note 1)
R ADC (1)
DDA
SSA
Sample and hold ADC
converter
REF+
/V
(see note 1)
REF+
Figure 59
REF–
C ADC (1)
STM32F103xx
not connected to
converter
12-bit
or
Figure
ai14388b
60,
ai14150c
V
DDA
)