STM32F103ZCT6 STMicroelectronics, STM32F103ZCT6 Datasheet - Page 105

MCU ARM 32BIT 256K FLASH 144LQFP

STM32F103ZCT6

Manufacturer Part Number
STM32F103ZCT6
Description
MCU ARM 32BIT 256K FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F103ZCT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Controller Family/series
(ARM Cortex) STM32
No. Of I/o's
112
Ram Memory Size
32KB
Cpu Speed
72MHz
No. Of Timers
8
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Interface Type
CAN/I2C/SPI/USART
Total Internal Ram Size
48KB
# I/os (max)
112
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
On-chip Adc
3(21-chx12-bit)
On-chip Dac
2(2-chx12-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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STM32F103xC, STM32F103xD, STM32F103xE
Figure 57. ADC accuracy characteristics
4095
4094
4093
7
6
5
4
3
2
1
0
V
SSA
[1LSB
Table 62.
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
4. Based on characterisation, not tested in production.
1
Symbol
E
O
IDEAL
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
EO
EG
ED
ET
EL
2
=
V
4096
3
REF+
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
ADC accuracy
4
(or
V
5
1 LSB
4096
DDA
Parameter
E
6
T
IDEAL
depending on package)]
E
7
L
(2)
(1) (2)(3)
Doc ID 14611 Rev 8
E
D
4093 4094 4095 4096
(3)
f
f
V
Measurements made after
ADC calibration
PCLK2
ADC
DDA
(1)
= 14 MHz, R
= 2.4 V to 3.6 V
E
= 56 MHz,
Test conditions
G
DD
V
DDA
, frequency, V
INJ(PIN)
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
=Differential Linearity Error: maximum deviation
AIN
and ΣI
< 10 kΩ,
REF
INJ(PIN)
and temperature ranges.
Electrical characteristics
in
±1.5
±1.5
±1.5
Typ
±2
±1
Section 5.3.14
Max
±2.5
±3
±2
±5
±3
(4)
does not
ai14395b
105/130
Unit
LSB

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