STM32F100C6T6B STMicroelectronics, STM32F100C6T6B Datasheet - Page 86

• Manufacturer Part Number: STM32F100C6T6B
• Description: MCU 32BIT ARM 32K FLASH 48LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F100C6T6B

• Featured Product: STM32 Value Line
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 37
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: STM32F100x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 4 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 5
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 10 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-10500

Revision history
86/87
Table 54.
06-May-2010
30-Mar-2010
04-Apr-2011
12-Jul-2010
Date
Document revision history (continued)
Revision
3
4
5
6
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Revision history corrected.
Updated
Values and note updated in
Run mode, code with data processing running from Flash
Table 17: Typical current consumption in Sleep mode, code running
from Flash or
Updated
and Standby modes
Added
vs. temperature at different VBAT values
Typical consumption for ADC1 corrected in
current
Maximum current consumption
frequency conditions corrected.
Updated
f
Small text changes.
Updated
Table 32: Electrical sensitivities on page 54
Updated
and
Updated
Updated
and
Updated
Updated footnotes below
and
Updated tw min in
characteristics on page 45
Updated startup time in
= 32.768 kHz) on page 48
Updated
Added
Updated
Corrected TTL and CMOS designations in
characteristics on page 59
Removed note on remapped characteristics from
characteristics on page 65
ADC
Doc ID 16455 Rev 6
Table 45: ADC accuracy on page 69
Table 45: ADC accuracy on page 69
Table 6: Current characteristics on page 33
max corrected in
Figure 14: Typical current consumption on VBAT with RTC on
Section 5.3.12: I/O current injection characteristics on page 55
consumption.
Table 15: Typical and maximum current consumptions in Stop
Table 6: Current characteristics
Table 30: EMI characteristics
Table 31: ESD absolute maximum ratings on page 54
Table 44: ADC accuracy - limited test conditions on page 69
Table 24: LSI oscillator characteristics on page 50
Table 44: ADC accuracy - limited test conditions on page 69
Figure 2: Clock tree
Table 23: HSI oscillator characteristics on page 49
Table 34: I/O static characteristics on page 56
RAM.
Table 19: High-speed external user clock
Table 42: ADC
Table 22: LSE oscillator characteristics (fLSE
Table 5: Voltage characteristics on page 32
Table 16: Typical current consumption in
to add FLITF clock
Changes
and
Output driving current
Typical current
characteristics.
Table 35: Output voltage
Table 18: Peripheral
Table 41: SPI
consumption:
corrected.
and
and