STM32F100C6T6B STMicroelectronics, STM32F100C6T6B Datasheet - Page 65

MCU 32BIT ARM 32K FLASH 48LQFP

STM32F100C6T6B

Manufacturer Part Number
STM32F100C6T6B
Description
MCU 32BIT ARM 32K FLASH 48LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F100C6T6B

Featured Product
STM32 Value Line
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
STM32F100x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
4 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
37
Number Of Timers
5
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-10500

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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
SPI interface characteristics
Unless otherwise specified, the parameters given in
performed under the ambient temperature, f
conditions summarized in
Refer to
input/output alternate function characteristics (NSS, SCK, MOSI, MISO).
Table 41.
1. Based on characterization, not tested in production.
2. Min time is for the minimum time to drive the output and the max time is for the maximum time to validate
3. Min time is for the minimum time to invalidate the output and the max time is for the maximum time to put
DuCy(SCK)
t
t
t
t
dis(SO)
t
w(SCKH)
t
w(SCKL)
su(NSS)
t
a(SO)
Symbol
1/t
t
t
t
t
t
t
h(NSS)
su(MI)
v(SO)
t
v(MO)
h(MO)
the data.
the data in Hi-Z
su(SI)
h(MI)
h(SO)
t
t
h(SI)
r(SCK)
f(SCK)
f
SCK
c(SCK)
(1)(2)
(1)
(1)(3)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
Section 5.3.12: I/O current injection characteristics
(1)
(1)
(1)
SPI characteristics
SPI clock frequency
SPI clock rise and fall
time
SPI slave input clock
duty cycle
NSS setup time
NSS hold time
SCK high and low time
Data input setup time
Data input hold time
Data output access time Slave mode, f
Data output disable time Slave mode
Data output valid time
Data output valid time
Data output hold time
Parameter
Table
Doc ID 16455 Rev 6
8.
Master mode
Slave mode
Capacitive load: C = 30 pF
Slave mode
Slave mode
Slave mode
Master mode, f
presc = 4
Master mode
Slave mode
Master mode
Slave mode
Slave mode (after enable edge)
Master mode (after enable
edge)
Slave mode (after enable edge)
Master mode (after enable
edge)
PCLKx
Conditions
PCLK
frequency and V
PCLK
Table 41
= 24 MHz
= 24 MHz,
for more details on the
are derived from tests
Electrical characteristics
DD
4t
2t
Min
PCLK
PCLK
30
15
supply voltage
50
5
5
5
4
2
2
0
3t
Max
PCLK
12
10
25
70
60
12
5
8
MHz
Unit
65/87
ns
ns
%

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