STM32F100C6T6B STMicroelectronics, STM32F100C6T6B Datasheet - Page 54

• Manufacturer Part Number: STM32F100C6T6B
• Description: MCU 32BIT ARM 32K FLASH 48LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F100C6T6B

• Featured Product: STM32 Value Line
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 37
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: STM32F100x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 4 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 5
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 10 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-10500

Electrical characteristics
5.3.11
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Electromagnetic Interference (EMI)
The electromagnetic field emitted by the device is monitored while a simple application is
executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with
IEC 61967-2 standard which specifies the test board and the pin loading.
Table 30.
Absolute maximum ratings (electrical sensitivity)
Based on three different tests (ESD, LU) using specific measurement methods, the device is
stressed in order to determine its performance in terms of electrical sensitivity.
Electrostatic discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts × (n+1) supply pins). This test
conforms to the JESD22-A114/C101 standard.
Table 31.
1. Based on characterization results, not tested in production.
Static latch-up
Two complementary static tests are required on six parts to assess the latch-up
performance:
●
●
These tests are compliant with EIA/JESD78 IC latch-up standard.
Table 32.
Symbol Parameter
V
V
Symbol
Symbol
S
ESD(HBM)
ESD(CDM)
EMI
LU
A supply overvoltage is applied to each power supply pin
A current injection is applied to each input, output and configurable I/O pin
Peak level
Static latch-up class
Electrostatic discharge
voltage (human body model)
Electrostatic discharge
voltage (charge device model)
EMI characteristics
ESD absolute maximum ratings
Electrical sensitivities
Parameter
V
LQFP100 package
compliant with SAE
J1752/3
Ratings
DD
= 3.6 V, T
Conditions
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Doc ID 16455 Rev 6
A
T
A
= 25°C,
= +105 °C conforming to JESD78
T
conforming to JESD22-A114
T
conforming to JESD22-C101
A
A
= +25 °C
= +25 °C
30 MHz to 130 MHz
0.1 MHz to 30 MHz
130 MHz to 1GHz
frequency band
SAE EMI Level
Monitored
Conditions
Conditions
Max vs. [f
Class
8/24 MHz
2
II
16
19
9
4
HSE
Maximum
value
/f
HCLK
2000
500
II level A
Class
(1)
]
dBµV
Unit
Unit
-
V