STM32F100C6T6B STMicroelectronics, STM32F100C6T6B Datasheet - Page 85

• Manufacturer Part Number: STM32F100C6T6B
• Description: MCU 32BIT ARM 32K FLASH 48LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F100C6T6B

• Featured Product: STM32 Value Line
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 37
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: STM32F100x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 4 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 5
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 10 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-10500

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
8
Revision history
Table 54.
26-Feb-2010
12-Oct-2009
Date
Document revision history
Revision
1
2
Initial release.
TFBGA64 package added (see
Note 5
I
removed from
Notes modified in
Figure 27: Recommended NRST pin protection
Note modified in
waveforms and measurement circuit(1)
Table 46: DAC characteristics
/non-buffered DAC
TIM2, TIM3, TIM4
HDMI-CEC electrical characteristics added.
Values added to:
–
–
–
–
–
–
–
–
Section 5.3.12: I/O current injection characteristics
Added figures:
–
–
–
–
–
INJ(PIN)
Table 12: Maximum current consumption in Run mode, code with
data processing running from Flash
Table 13: Maximum current consumption in Run mode, code with
data processing running from RAM
Table 14: STM32F100xxB maximum current consumption in Sleep
mode, code running from Flash or RAM
Table 15: Typical and maximum current consumptions in Stop and
Standby modes
Table 18: Peripheral current consumption
Table 29: EMS characteristics
Table 30: EMI characteristics
Table 47: TS characteristics
Figure 12: Maximum current consumption in Run mode versus
frequency (at 3.6 V) - code with data processing running from RAM,
peripherals enabled
Figure 13: Maximum current consumption in Run mode versus
frequency (at 3.6 V) - code with data processing running from RAM,
peripherals disabled
Figure 15: Typical current consumption in Stop mode with regulator
in Run mode versus temperature at VDD = 3.3 V and 3.6 V
Figure 16: Typical current consumption in Stop mode with regulator
in Low-power mode versus temperature at VDD = 3.3 V and 3.6 V
Figure 17: Typical current consumption in Standby mode versus
temperature at VDD = 3.3 V and 3.6 V
Doc ID 16455 Rev 6
modified in
modified in
Table 25: Low-power mode wakeup
Table 39: I2C
Table 34: I/O static
and
Table 4: STM32F100xx pin
added.
Table 6: Current
TIM15, TIM16 and TIM17
modified.
Changes
characteristics.
Table 50
characteristics. Conditions
characteristics.
modified.
Figure 36: 12-bit buffered
and
Table
definitions.
Figure 28: I2C bus AC
modified.
updated.
timings.
modified.
41).
Revision history
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