LH7A400N0G000B5;55 NXP Semiconductors, LH7A400N0G000B5;55 Datasheet - Page 12

• Manufacturer Part Number: LH7A400N0G000B5;55
• Description: IC ARM9 BLUESTREAK MCU 256BGA
• Manufacturer: NXP Semiconductors
• Series: BlueStreak ; LH7Ar

Specifications of LH7A400N0G000B5;55

• Core Size: 16/32-Bit
• Core Processor: ARM9
• Speed: 200MHz
• Connectivity: EBI/EMI, IrDA, Microwire, MMC, SmartCard, SPI, SSI, SSP, UART/USART, USB
• Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Type: ROMless
• Ram Size: 80K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-BGA
• Controller Family/series: (ARM9)
• No. Of I/o's: 60
• Ram Memory Size: 80KB
• Cpu Speed: 200MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 2
• Digital Ic Case Style: BGA
• Processor Series: LH7A4
• Core: ARM9TDMI
• Data Bus Width: 32 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4334; 935285038557

LH7A400
1. Signals beginning with ‘n’ are Active LOW.
2. The SCLK pin can source up to 12 mA and sink up to 20 mA. See ‘DC Characteristics’.
3. Schmitt trigger input; see ’DC Specifications’, page 31 for triggers points and hysteresis.
4. Input only for JTAG boundary scan mode.
5. Output only for JTAG boundary scan mode.
6. The internal pullup and pull-down resistance on all digital I/O pins is 50 k
7. When used as SMBCLK, this pin must have a resistor.
8. The RESET STATE is defined as the state during power-on reset.
9. The STANDBY STATE is defined as the state when the device is in standby. During this state,
10. All unused USB Device pins with a differential pair must be pulled
12
BGA
R12
R15
P11
T12
PIN
G1
G2
G4
G5
H1
H2
H3
C3
D1
D2
A1
B1
B2
C1
F6
F5
I/O cells are forced to input (Input), output driving low (LOW), output driving high (HIGH), or their
current state is preserved (No Change). In some case, function selection has an overall effect on the standby state.
to ground with a 15 k
Normal
MODE
JTAG
LFBGA
T14
T15
P15
P13
PIN
G2
G1
H3
H5
H6
H7
H2
H1
C2
D3
C1
F5
E3
F6
E5
J1
Table 4. nTest Pin Function
nTEST0
COL0
COL1
COL2
COL3
COL4
COL5
COL6
COL7
TBUZ
MEDCHG
WIDTH0
WIDTH1
BATOK
nBATCHG
TDI
TCK
TDO
TMS
nTEST0
nTEST1
0
1
SIGNAL
Ω
resistor.
nTEST1
Keyboard Interface
Timer Buzzer (254 kHz MAX.)
Boot Device Media Change. Used with WIDTH0
and WIDTH1 to specify boot memory device.
External Memory Width Pins. Also, used with
MEDCHG to specify the boot memory device size.
The pins must be pulled HIGH with a 33 kΩ resistor.
Battery OK
Battery Change
JTAG Data In. This signal is internally pulled-up t
o VDD.
JTAG Clock. This signal should be externally
pulled-up to VDD with a 33 kΩ resistor.
JTAG Data Out. This signal should be externally
pulled up to VDD with a 33 kΩ resistor.
JTAG Test Mode select. This signal is internally
pulled-up to VDD.
Test Pin 0. Internally pulled up to VDD. For Normal
mode, leave open. For JTAG mode, tie to GND.
See Table 4.
Test Pin 1. internally pulled up to VDD. For Normal
and JTAG mode, leave open. See Table 4.
1
1
Table 3. Functional Pin List (Cont’d)
nURESET
DESCRIPTION
Rev. 01 — 16 July 2007
1
x
NXP Semiconductors
Ω
RESET
STATE
High-Z
HIGH
LOW
Input
Input
Input
Input
Input
Input
Input
Input
No Change
No Change
No Change
No Change
No Change
No Change
No Change
No Change
No Change
STANDBY
STATE
HIGH
LOW
32-Bit System-on-Chip
Preliminary data sheet
OUTPUT
DRIVE
8 mA
8 mA
4 mA
I/O NOTES
O
O
O
I
I
I
I
I
I
I
I
3
3
3
3
4
3
4
4