ATSAM3U1CA-CU Atmel, ATSAM3U1CA-CU Datasheet - Page 1145
ATSAM3U1CA-CU
Manufacturer Part Number
ATSAM3U1CA-CU
Description
IC MCU 32BIT 64KB FLASH 100TFBGA
Manufacturer
Atmel
Series
SAM3Ur
Specifications of ATSAM3U1CA-CU
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
96MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
57
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 4x10b, 4x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFBGA
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Processor Series
ATSAM3x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
20 KB
Interface Type
3xUSART, TWI, 4xSPI, Bus
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
57
Number Of Timers
8
Operating Supply Voltage
1.62 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3U-EK
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Available stocks
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Manufacturer
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Price
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44.3
Figure 44-3. 144-lead LQFP Package Drawing
Notes:
Table 44-8.
Table 44-9.
Table 44-10. Package Reference
6430D–ATARM–25-Mar-11
TBD
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
144-lead LQFP Package
1. This drawing is for general information only; refer to JEDEe Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum
4. b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between pro-
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
plastic body size dimensions including mold mismatch.
trusion and an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
Device Maximum Weight
144-lead Package Characteristics
mg
3
MS-026
e3
SAM3U Series
1145
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