PIC24FJ256GB206-I/MR Microchip Technology, PIC24FJ256GB206-I/MR Datasheet - Page 348
![MCU PIC 16BIT FLASH 256K 64VQFN](/photos/19/6/190652/4732178_sml.jpg)
PIC24FJ256GB206-I/MR
Manufacturer Part Number
PIC24FJ256GB206-I/MR
Description
MCU PIC 16BIT FLASH 256K 64VQFN
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Specifications of PIC24FJ256GB206-I/MR
Core Size
16-Bit
Program Memory Size
256KB (85.5K x 24)
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Controller Family/series
PIC24
No. Of I/o's
52
Ram Memory Size
96KB
Cpu Speed
32MHz
No. Of Timers
5
No. Of Pwm Channels
9
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
96 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
29
Number Of Timers
5
Operating Supply Voltage
2.2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM240001, MA240021
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
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PIC24FJ256GB210 FAMILY
29.1
FIGURE 29-1:
TABLE 29-1:
TABLE 29-2:
DS39975A-page 348
PIC24FJ256GB210 family:
Power Dissipation (with ENVREG = 1):
Maximum Allowed Power Dissipation
Package Thermal Resistance, 12x12x1 mm TQFP
Package Thermal Resistance, 10x10x1 mm TQFP
Package Thermal Resistance, 9x9x0.9 mm QFN
Package Thermal Resistance, 10x10x1.1 mm BGA
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation: P
I/O Pin Power Dissipation:
DC Characteristics
P
I
/
O
Junction to ambient thermal resistance, Theta-
Note:
= ({V
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
PIC24FJ256GB210 FAMILY VOLTAGE FREQUENCY GRAPH (INDUSTRIAL)
V
V
3.6V
2.2V
– V
BOR
CAP
Characteristic
OH
(nominal On-Chip Regulator output voltage) = 1.8V.
} x I
Rating
OH
) + (V
INT
= V
OL
DD
x I
x (I
OL
DD
)
PIC24FJXXXDA1
– I
Frequency
JA
OH
)
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
69.4
76.6
28.0
40.2
Min
Typ
-40
-40
(T
JMAX
2010 Microchip Technology Inc.
P
32 MHz
INT
Max
Typ
—
—
—
—
—
—
– T
+ P
2.2V
V
3.6V
A
I
BOR
/
)/
O
JA
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Note
Unit
°C
°C
W
W
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