PIC18LF1330-I/SO Microchip Technology, PIC18LF1330-I/SO Datasheet - Page 198
![IC PIC MCU FLASH 4KX16 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC18LF1330-I/SO
Manufacturer Part Number
PIC18LF1330-I/SO
Description
IC PIC MCU FLASH 4KX16 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.AC162078.pdf
(318 pages)
3.PIC18F1230-ISO.pdf
(6 pages)
4.PIC18F1230-ISO.pdf
(12 pages)
5.PIC18F1230-ISO.pdf
(4 pages)
6.PIC18F1230-IP.pdf
(312 pages)
Specifications of PIC18LF1330-I/SO
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
18-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
16
Eeprom Memory Size
128Byte
Ram Memory Size
256Byte
Cpu Speed
40MHz
No.
RoHS Compliant
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF1330-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- AC162078 PDF datasheet #2
- PIC18F1230-ISO PDF datasheet #3
- PIC18F1230-ISO PDF datasheet #4
- PIC18F1230-ISO PDF datasheet #5
- PIC18F1230-IP PDF datasheet #6
- Current page: 198 of 312
- Download datasheet (6Mb)
PIC18F1230/1330
19.3
The Two-Speed Start-up feature helps to minimize the
latency period from oscillator start-up to code execution
by allowing the microcontroller to use the INTOSC
oscillator as a clock source until the primary clock
source is available. It is enabled by setting the IESO
Configuration bit.
Two-Speed Start-up should be enabled only if the
primary oscillator mode is LP, XT, HS or HSPLL
(crystal-based modes). Other sources do not require
an OST start-up delay; for these, Two-Speed Start-up
should be disabled.
When enabled, Resets and wake-ups from Sleep mode
cause the device to configure itself to run from the
internal oscillator block as the clock source, following
the time-out of the Power-up Timer, after a Power-on
Reset is enabled. This allows almost immediate code
execution while the primary oscillator starts and the
OST is running. Once the OST times out, the device
automatically switches to PRI_RUN mode.
To use a higher clock speed on wake-up, the INTOSC
or postscaler clock sources can be selected to provide
a higher clock speed by setting bits, IRCF2:IRCF0,
immediately after Reset. For wake-ups from Sleep, the
INTOSC or postscaler clock sources can be selected
by setting the IRCF2:IRCF0 bits prior to entering Sleep
mode.
FIGURE 19-2:
DS39758C-page 196
Two-Speed Start-up
Note 1: T
CPU Clock
Multiplexer
PLL Clock
Peripheral
Program
INTOSC
Counter
Output
OSC1
Clock
2: Clock transition typically occurs within 2-4 T
Wake from Interrupt Event
TIMING TRANSITION FOR TWO-SPEED START-UP (INTOSC TO HSPLL)
OST
= 1024 T
PC
OSC
Q1
T
; T
OST
PLL
(1)
= 2 ms (approx). These intervals are not shown to scale.
Advance Information
Q2
PC + 2
T
OSTS bit Set
PLL
Q3
(1)
Q4
OSC
In all other power-managed modes, Two-Speed Start-up
is not used. The device will be clocked by the currently
selected clock source until the primary clock source
becomes available. The setting of the IESO bit is
ignored.
19.3.1
While using the INTOSC oscillator in Two-Speed
Start-up, the device still obeys the normal command
sequences for entering power-managed modes,
including
Section 3.1.4 “Multiple Sleep Commands”). In
practice, this means that user code can change the
SCS1:SCS0 bit settings or issue SLEEP instructions
before the OST times out. This would allow an applica-
tion to briefly wake-up, perform routine “housekeeping”
tasks and return to Sleep before the device starts to
operate from the primary oscillator.
User code can also check if the primary clock source is
currently providing the device clocking by checking the
status of the OSTS bit (OSCCON<3>). If the bit is set,
the primary oscillator is providing the clock. Otherwise,
the internal oscillator block is providing the clock during
wake-up from Reset or Sleep mode.
.
Q1
1
Transition
2
Clock
n-1 n
multiple
(2)
SPECIAL CONSIDERATIONS FOR
USING TWO-SPEED START-UP
PC + 4
SLEEP
Q2
© 2007 Microchip Technology Inc.
Q3 Q4
instructions
Q1
PC + 6
Q2
Q3
(refer
to
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