MC9S12H256VFVE Freescale Semiconductor, MC9S12H256VFVE Datasheet - Page 94

• Manufacturer Part Number: MC9S12H256VFVE
• Description: IC MCU 256K FLASH 16MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12H256VFVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 99
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LQFP
• Processor Series: S12H
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 12 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 115
• Number Of Timers: 8
• Operating Supply Voltage: - 0.3 V to + 6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MC9S12H256 Device User Guide — V01.20
The total power dissipation can be calculated from:
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
T J
T A
P D
P INT
Num C
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
JA
1
2
3
4
94
P
=
=
=
IO
=
T Thermal Resistance LQFP112, single sided PCB
T
T Thermal Resistance LQFP 144, single sided PCB
T
Junction Temperature, [ C
Ambient Temperature, [ C
=
Total Chip Power Dissipation, [W]
is the sum of all output currents on I/O ports associated with VDDX1,2 and VDDM1,2,3.
Package Thermal Resistance, [ C/W]
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes
Thermal Resistance LQFP 144, double sided PCB
with 2 internal planes
Chip Internal Power Dissipation, [W]
Table A-5 Thermal Package Characteristics
3
Rating
P INT
P IO
=
T J
I DDR V DDR
P D
=
=
T A
=
i
P INT
2
R DSON
+
P D
Symbol
+
+
P IO
JA
JA
JA
JA
I DDA V DDA
JA
I IO
i
2
Min
–
–
–
–
1
Typ
–
–
–
–
Max
54
41
45
37
o
o
o
o
Unit
C/W
C/W
C/W
C/W