MC9S12H256VFVE Freescale Semiconductor, MC9S12H256VFVE Datasheet - Page 2

• Manufacturer Part Number: MC9S12H256VFVE
• Description: IC MCU 256K FLASH 16MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12H256VFVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 99
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LQFP
• Processor Series: S12H
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 12 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 115
• Number Of Timers: 8
• Operating Supply Voltage: - 0.3 V to + 6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision History
Freescale reserves the right to make changes without further notice to any products herein to improve reliability, function or
design. Freescale does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. Freescale products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Freescale product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Freescale products for any such unintended or unauthorized
application, Buyer shall indemnify and hold Freescale and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Freescale was negligent regarding the design or manufacture of the part.
Number
Version
V01.00
V01.01
V01.02
V01.03
V01.04
V01.05
V01.06
V01.07
V01.08
V01.09
V01.10
Revision
14 MAY
30 MAY
03 AUG
29 AUG
07 MAR
11 JUN
18 JUN
28 JUN
10 MAI
12 JUL
16 JUL
Date
2001
2001
2001
2001
2001
2001
2001
2001
2001
2001
2001
Effective
03 AUG
29 AUG
03 APR
10 MAY
14 MAY
30 MAY
11 JUN
18 JUN
28 JUN
12 JUL
16 JUL
Date
2001
2001
2001
2001
2001
2001
2001
2001
2001
2001
2001
Author
Initial version.
- Minor formal corrections
- Changed ATD coupling ratio to10
- Changed V
- Removed 112-pin package references
- Changed ATD Electrical Characteristics separate coupling ratio for
positive and negative bulk current injection
- Reinserted 112-pin package information.
- Removed SRSv2 comment from preface
- Corrected RESET pin to active low in table 2-1
- Adapted style and wording to 9DP256 device user guide
- Minor format and wording improvements
- Added SRAM data retention disclaimer
- Changed Oscillator Characteristics t
Clock Monitor Time-out by Clock Monitor Failure Assert Frequency
- Changed Self Clock Mode Frequency min 1MHz and max 5.5MHz
- Changed I
- Corrected typo in Figure 2-1 pin 76: PK3 -> PK2
- Added t
- Added typ value for t
- Corrected t
- Updated thermal resistances as per Thermal Simulation Report,
July 10, 2001
- updated EEPROM size
- added DC cutoff capacitor into layout proposals
- minor updates
- updated electrical spec
EXTR
DDPS
EXTL
DD5
and t
to 4.5V
(RTI and COP disabled) to 400 A
and t
Description of Changes
EXTF
UPOSC
EXTH
to Oscillator Characteristics
values
-2
CQOUT
max 2.5s and replaced
9S12H256BDGV1/D
2