PIC18LF4685-I/P Microchip Technology, PIC18LF4685-I/P Datasheet - Page 459
![IC PIC MCU FLASH 48KX16 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18LF4685-I/P
Manufacturer Part Number
PIC18LF4685-I/P
Description
IC PIC MCU FLASH 48KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PCM18XT0.pdf
(484 pages)
3.PIC18F2221-ISO.pdf
(46 pages)
4.PIC18F2682-ISP.pdf
(6 pages)
5.PIC18F2682-ISP.pdf
(4 pages)
Specifications of PIC18LF4685-I/P
Core Size
8-Bit
Program Memory Size
96KB (48K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC18
No. Of I/o's
36
Eeprom Memory Size
1024Byte
Ram Memory Size
3.25KB
Cpu Speed
40MHz
No. Of Timers
4
Package
40PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
2.5|3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
44
Interface Type
CAN/I2C/SPI/USART
On-chip Adc
11-chx10-bit
Number Of Timers
4
Core
PIC
Processor Series
PIC18LF
Maximum Clock Frequency
40 MHz
Data Ram Size
3.25 KB
Mounting Style
Through Hole
A/d Bit Size
10 bit
A/d Channels Available
11
Height
4.95 mm
Length
53.21 mm
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
14.73 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF4685-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18LF4685-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PCM18XT0 PDF datasheet #2
- PIC18F2221-ISO PDF datasheet #3
- PIC18F2682-ISP PDF datasheet #4
- PIC18F2682-ISP PDF datasheet #5
- Current page: 459 of 484
- Download datasheet (9Mb)
29.2
The following sections give the technical details of the packages.
© 2009 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
PIC18F2682/2685/4682/4685
Dimension Limits
Units
A2
A1
E1
eB
b1
N
D
A
E
e
L
c
b
e
1.345
.120
.015
.290
.240
.008
.040
.014
A2
MIN
.110
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
DS39761C-page 459
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