DSPIC30F2011-30I/P Microchip Technology, DSPIC30F2011-30I/P Datasheet - Page 166
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DSPIC30F2011-30I/P
Manufacturer Part Number
DSPIC30F2011-30I/P
Description
IC DSPIC MCU/DSP 12K 18DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20ISO.pdf
(210 pages)
3.DSPIC30F2011-20ISO.pdf
(14 pages)
4.DSPIC30F2011-20ISO.pdf
(6 pages)
5.DSPIC30F2011-20ISO.pdf
(18 pages)
6.DSPIC30F2011-20IP.pdf
(26 pages)
7.DSPIC30F2012-30ISO.pdf
(205 pages)
Specifications of DSPIC30F2011-30I/P
Program Memory Type
FLASH
Program Memory Size
12KB (4K x 24)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
1 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011, DM300018, DM183021
Minimum Operating Temperature
- 40 C
Package
18PDIP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
I2C/SPI/UART
On-chip Adc
8-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0202 - ADAPTER MPLABICE 18P 300 MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F2011-30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2011-30I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F2011/2012/3012/3013
FIGURE 20-7:
TABLE 20-22: BAND GAP START-UP TIME REQUIREMENTS
DS70139G-page 166
AC CHARACTERISTICS
SY40
Note 1:
Param
(see Note)
Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set.
Enable Band Gap
No.
2:
T
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
BGAP
0V
Band Gap Start-up Time
BAND GAP START-UP TIME CHARACTERISTICS
Characteristic
(1)
SY40
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
—
Typ
40
(2)
Max
65
Units
-40°C ≤ T
-40°C ≤ T
µs
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13> bit
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
© 2010 Microchip Technology Inc.
Conditions
V
BGAP
Band Gap
Stable