MC9S12C128CFUE Freescale Semiconductor, MC9S12C128CFUE Datasheet - Page 185

• Manufacturer Part Number: MC9S12C128CFUE
• Description: IC MCU 128K FLASH 25MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12C128CFUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 60
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/2.97V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Processor Series: S12C
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 4000 B
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 61
• Number Of Timers: 1
• Operating Supply Voltage: - 0.3 V to + 6.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68EVB912C32EE
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Figure 6-13
occur if a POD device is connected to the target BKGD pin and the target is already in debug active mode.
Consider that the target CPU is executing a pending BDM command at the exact moment the POD is being
connected to the BKGD pin. In this case, an ACK pulse is issued along with the SYNC command. In this
case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. Because this is
not a probable situation, the protocol does not prevent this conflict from happening.
The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE
BDM commands. This provides backwards compatibility with the existing POD devices which are not
able to execute the hardware handshake protocol. It also allows for new POD devices, that support the
hardware handshake protocol, to freely communicate with the target device. If desired, without the need
for waiting for the ACK pulse.
Freescale Semiconductor
(TARGET MCU)
BKGD PIN
DRIVES SYNC
TARGET MCU
TO BKGD PIN
BDM CLOCK
DRIVES TO
BKGD PIN
BKGD PIN
HOST
shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could
This information is being provided so that the MCU integrator will be aware
that such a conflict could eventually occur.
READ_BYTE
HOST
AND STARTS TO EXECUTES
Figure 6-12. ACK Abort Procedure at the Command Level
READ_BYTE CMD IS ABORTED
Figure 6-13. ACK Pulse and SYNC Request Conflict
THE READ_BYTE CMD
MEMORY ADDRESS
TARGET
BY THE SYNC REQUEST
HOST SYNC REQUEST PULSE
BDM DECODE
ACK PULSE
16 CYCLES
(OUT OF SCALE)
MC9S12C-Family / MC9S12GC-Family
HOST AND
TARGET DRIVE
TO BKGD PIN
AT LEAST 128 CYCLES
Rev 01.24
NOTE
Chapter 6 Background Debug Module (BDMV4) Block Description
ELECTRICAL CONFLICT
HIGH-IMPEDANCE
HOST
SYNC RESPONSE
FROM THE TARGET
(OUT OF SCALE)
READ_STATUS
TARGET
NEW BDM COMMAND
NEW BDM COMMAND
HOST
SPEEDUP PULSE
TARGET
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