C8051F305-GM Silicon Laboratories Inc, C8051F305-GM Datasheet - Page 31

• Manufacturer Part Number: C8051F305-GM
• Description: IC 8051 MCU 2K FLASH 11QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F30xr

Specifications of C8051F305-GM

• Program Memory Type: FLASH
• Program Memory Size: 2KB (2K x 8)
• Package / Case: 11-VQFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C/SMBus/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 8
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F300DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 8 Channel
• No. Of I/o's: 8
• Ram Memory Size: 256Byte
• Cpu Speed: 25MHz
• No. Of Timers: 3
• Rohs Compliant: Yes
• Package: 11QFN EP
• Device Core: 8051
• Family Name: C8051F30x
• Maximum Speed: 25 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1444 - ADAPTER PROGRAM TOOLSTICK F300
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1251

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Notes: General
Notes: Solder Mask Design
Notes: Stencil Design
Notes: Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 3 x 1 array of 1.30 x 0.60 mm openings on 0.80 mm pitch should be used for the center
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
mask and the metal pad is to be 60 µm minimum, all the way around the pad.
assure good solder paste release.
ground pad.
Small Body Components.
Dimension
C1
C2
X1
X2
Y1
Y2
Table 4.3. QFN-11 Landing Diagram Dimensions
E
Figure 4.4. Typical QFN-11 Landing Diagram
Rev. 2.9
MIN
2.75
2.75
0.20
1.40
0.65
2.30
C8051F300/1/2/3/4/5
0.50 BSC
MAX
2.85
2.85
0.30
1.50
0.75
2.40
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