LPC2378FBD144,551 NXP Semiconductors, LPC2378FBD144,551 Datasheet - Page 44

• Manufacturer Part Number: LPC2378FBD144,551
• Description: IC ARM7 MCU FLASH 512K 144LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2378FBD144,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 144-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 104
• Ram Size: 58K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 58 KB
• Interface Type: CAN/I2S/ISP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSDKLPC2378-02, MCB2370, MCB2370U, MCB2370UME
• Development Tools By Supplier: OM10094
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCDMCB2370UME - BOARD EVAL MCB2370 + ULINK-MEMCB2370U - BOARD EVAL MCB2370 + ULINK2MCB2370 - BOARD EVAL NXP LPC2368/2378568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3998; 935282458551; LPC2378FBD144-S

NXP Semiconductors
LPC2377_78
Product data sheet
10.2 Deep power-down mode
Fig 6.
Fig 7.
I
DD(DCDC)pd(3v3)
I
DD(IO)
(μA)
800
600
400
200
300
200
100
(μA)
V
Total DC-to-DC converter supply current I
in Power-down mode
I/O maximum supply current I
mode
V
0
0
−40
DD(3V3)
−40
DD(3V3)
All information provided in this document is subject to legal disclaimers.
= V
= V
i(VBAT)
DD(DCDC)(3V3)
V
V
Rev. 5 — 17 June 2010
−15
−15
DD(DCDC)(3V3)
DD(DCDC)(3V3)
= 3.3 V; T
V
V
DD(3V3)
DD(3V3)
= 3.3 V; T
amb
= 3.3 V
= 3.0 V
= 3.3 V
= 3.0 V
= 25 °C.
10
10
DD(IO)
amb
= 25 °C.
versus temperature in Deep power-down
Single-chip 16-bit/32-bit microcontrollers
DD(DCDC)pd(3V3)
35
35
60
at different temperatures
60
LPC2377/78
temperature (°C)
temperature (°C)
002aae051
002aae046
© NXP B.V. 2010. All rights reserved.
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