LPC3130FET180,551 NXP Semiconductors, LPC3130FET180,551 Datasheet - Page 67

• Manufacturer Part Number: LPC3130FET180,551
• Description: IC ARM9 MCU 180MHZ 180-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3130FET180,551

• Package / Case: 180-TFBGA
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, PWM, WDT
• Program Memory Type: ROMless
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC31
• Core: ARM926EJ-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 96 KB
• Interface Type: I2C/I2S/UART/USB
• Maximum Clock Frequency: 180 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Cpu Family: LPC3000
• Device Core: ARM926EJ-S
• Device Core Size: 16/32Bit
• Frequency (max): 180MHz
• Program Memory Size: Not Required
• Total Internal Ram Size: 96KB
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 1.2/1.8/2.8/3.3/5V
• Operating Supply Voltage (max): 1.3/3.6V
• Operating Supply Voltage (min): 1/1.1/1.65/2.7V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 180
• Package Type: TFBGA
• Package: 180TFBGA
• Family Name: LPC3000
• Maximum Speed: 180 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4850 - KIT EVAL FOR LPC313X568-4062 - DEBUGGER J-LINK JTAG568-4061 - DEBUGGER U-LINK2 JTAG FOR NXP
• Number Of I /o: -
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4696; 935288013551; LPC3130FET180-S

NXP Semiconductors
13. Abbreviations
LPC3130_3131
Preliminary data sheet
Table 30.
Acronym
A/D
ADC
AHB
AMBA
APB
ATA
BIU
CE
CGU
CRC
DFU
DMA
DRM
DSP
EBI
ECC
EOP
ESD
FIFO
FPGA
GF
INTC
IOCONFIG
IOM
IrDA
IROM
ISRAM
ISROM
JTAG
LSB
MCI
MCU
MMC
MPMC
OTG
PCM
PHY
PLL
PWM
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Analog-to-Digital
Analog-to-Digital Converter
Advanced High-performance Bus
Advanced Microcontroller Bus Architecture
ARM Peripheral Bus
Advanced Transport Architecture
Bus Interface Unit
Consumer Electronics
Clock Generation Unit
Cyclic Redundancy Check
Device Firmware Upgrade
Direct Memory Access
Digital Rights Management
Digital Signal Processing
External Bus Interface
Error Correction Code
End Of Packet
Electrostatic Discharge
First In, First Out
Field Programmable Gate Array
Galois Field
Interrupt Controller
Input Output Configuration
ISDN Oriented Modular
Infrared Data Association
Internal ROM
Internal Static RAM
Internal Static ROM
Joint Test Action Group
Least Significant Bit
Memory Card Interface
MicroController Unit
Multi-Media Card
Multi-Port Memory Controller
On-The-Go
Pulse Code Modulation
Physical Layer
Phase Locked Loop
Pulse Width Modulation
Rev. 1.04 — 27 May 2010
Low-cost, low-power ARM926EJ-S microcontrollers
LPC3130/3131
© NXP B.V. 2010. All rights reserved.
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