PIC18F2510-I/SP Microchip Technology, PIC18F2510-I/SP Datasheet - Page 315

IC MCU FLASH 16KX16 28-DIP

PIC18F2510-I/SP

Manufacturer Part Number
PIC18F2510-I/SP
Description
IC MCU FLASH 16KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2510-I/SP

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
25
Program Memory Type
FLASH
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
25
Ram Memory Size
1.5KB
Cpu Speed
40MHz
No. Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F2510-I/SP
Manufacturer:
TM
Quantity:
50 000
25.2
© 2009 Microchip Technology Inc.
PIC18LF2X1X/4X1X
PIC18F2X1X/4X1X
ParamNo.
Legend:
Note 1:
(Industrial)
(Industrial, Extended)
2:
3:
4:
5:
DC Characteristics:
Power-down Current (I
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
For RC oscillator configurations, current through R
estimated by the formula Ir = V
Low-power Timer1 oscillator selected.
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
Extended devices only
PIC18LF2X1X/4X1X
PIC18LF2X1X/4X1X
Device
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
All devices
DD
; WDT enabled/disabled as specified.
PD
DD
)
(1)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Power-Down and Supply Current
PIC18F2X1X/4X1X (Industrial)
PIC18LF2X1X/4X1X (Industrial)
Typ
measurements in active operation mode are:
0.1
0.1
0.2
0.1
0.1
0.3
0.1
0.1
0.4
10
DD
/2R
EXT
Max
950
120
1.0
1.4
1.9
2.0
15
5
2
8
(mA) with R
Units
μA
μA
μA
μA
μA
μA
μA
μA
μA
nA
EXT
EXT
is not included. The current through the resistor can be
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
in kΩ.
PIC18F2X1X/4X1X
+125°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
-40°C
A
A
A
≤ +85°C for industrial
≤ +85°C for industrial
≤ +125°C for extended
Conditions
DD
or V
SS
DD
;
and all features that
(Sleep mode)
(Sleep mode)
(Sleep mode)
DS39636D-page 317
V
V
V
DD
DD
DD
= 2.0V,
= 3.0V,
= 5.0V,

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