DSPIC30F2010-30I/SP Microchip Technology, DSPIC30F2010-30I/SP Datasheet - Page 34
DSPIC30F2010-30I/SP
Manufacturer Part Number
DSPIC30F2010-30I/SP
Description
IC DSPIC MCU/DSP 12K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2010-20ISO.pdf
(202 pages)
3.DSPIC30F2010-20ISO.pdf
(18 pages)
4.DSPIC30F2010-20ISO.pdf
(6 pages)
5.DSPIC30F2010-20ISO.pdf
(26 pages)
6.DSPIC30F2010-20IMM.pdf
(204 pages)
Specifications of DSPIC30F2010-30I/SP
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
20
Flash Memory Size
12KB
Supply Voltage Range
2.5V To 5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F2010-30I
DSPIC30F2010-30I
DSPIC30F2010-30I/SPG
DSPIC30F201030ISP
DSPIC30F2010-30I
DSPIC30F2010-30I/SPG
DSPIC30F201030ISP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F2010-30I/SP
Manufacturer:
Microchip Technology
Quantity:
300
Part Number:
DSPIC30F2010-30I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F2010
FIGURE 4-1:
DS70118J-page 34
Byte
Address
0x1100
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
MODULO ADDRESSING OPERATION EXAMPLE
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
DO
MOV
AGAIN: INC
#0x1100,W0
W0, XMODSRT
#0x1163,W0
W0,MODEND
#0x8001,W0
W0,MODCON
#0x0000,W0
#0x1110,W1
AGAIN,#0x31
W0, [W1++]
W0,W0
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;W0 holds buffer fill value
;point W1 to buffer
;fill the 50 buffer locations
;fill the next location
;increment the fill value
© 2011 Microchip Technology Inc.