PIC18F26J11-I/SO Microchip Technology, PIC18F26J11-I/SO Datasheet - Page 349
![IC PIC MCU FLASH 64K 2V 28-SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC18F26J11-I/SO
Manufacturer Part Number
PIC18F26J11-I/SO
Description
IC PIC MCU FLASH 64K 2V 28-SOIC
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.MA180023.pdf
(528 pages)
2.PIC18LF24J10-ISS.pdf
(32 pages)
3.PIC18F24J11-ISS.pdf
(14 pages)
4.PIC18F26J11-ISO.pdf
(28 pages)
Specifications of PIC18F26J11-I/SO
Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3776 B
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
48 MHz
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183032, MA180023, DM183022
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- MA180023 PDF datasheet
- PIC18LF24J10-ISS PDF datasheet #2
- PIC18F24J11-ISS PDF datasheet #3
- PIC18F26J11-ISO PDF datasheet #4
- Current page: 349 of 528
- Download datasheet (8Mb)
After the A/D module has been configured as desired,
the selected channel must be acquired before the
conversion is started. The analog input channels must
have their corresponding TRIS bits selected as an
input. To determine acquisition time, see Section 20.1
“A/D Acquisition Requirements”. After this acquisi-
tion time has elapsed, the A/D conversion can be
started. An acquisition time can be programmed to
occur between setting the GO/DONE bit and the actual
start of the conversion.
The following steps should be followed to do an A/D
conversion:
1.
FIGURE 20-2:
© 2009 Microchip Technology Inc.
Configure the A/D module:
• Configure the required ADC pins as analog
• Set voltage reference using ADCON0
• Select A/D input channel (ADCON0)
• Select A/D acquisition time (ADCON1)
• Select A/D conversion clock (ADCON1)
• Turn on A/D module (ADCON0)
pins using ANCON0, ANCON1
Legend: C
V
AIN
R
S
V
I
R
SS
C
R
LEAKAGE
T
PIN
IC
HOLD
SS
ANALOG INPUT MODEL
ANx
C
5 pF
PIN
= Input Capacitance
= Threshold Voltage
= Leakage Current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance (from DAC)
= Sampling Switch Resistance
various junctions
V
DD
V
V
T
T
= 0.6V
= 0.6V
I
±100 nA
PIC18F46J11 FAMILY
LEAKAGE
2.
3.
4.
5.
6.
7.
R
IC
Configure A/D interrupt (if desired):
• Clear ADIF bit
• Set ADIE bit
• Set GIE bit
Wait the required acquisition time (if required).
Start conversion:
• Set GO/DONE bit (ADCON0<1>)
Wait for A/D conversion to complete, by either:
• Polling for the GO/DONE bit to be cleared
OR
• Waiting for the A/D interrupt
Read A/D Result registers (ADRESH:ADRESL);
clear bit, ADIF, if required.
For next conversion, go to step 1 or step 2, as
required. The A/D conversion time per bit is
defined as T
required before next acquisition starts.
≤ 1k
SS
Sampling
Switch
V
DD
AD
R
SS
. A minimum wait of 2 T
Sampling Switch
1
V
SS
C
2
HOLD
3
DS39932C-page 349
= 25 pF
(kΩ)
4
AD
is
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