PIC16F1938-I/ML Microchip Technology, PIC16F1938-I/ML Datasheet - Page 373

IC MCU 8BIT FLASH 28QFN

PIC16F1938-I/ML

Manufacturer Part Number
PIC16F1938-I/ML
Description
IC MCU 8BIT FLASH 28QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr

Specifications of PIC16F1938-I/ML

Core Size
8-Bit
Program Memory Size
28KB (16K x 14)
Oscillator Type
Internal
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC16F
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
1024Byte
Cpu Speed
32MHz
Package
28QFN EP
Device Core
PIC
Family Name
PIC16
Maximum Speed
32 MHz
Operating Supply Voltage
2.5|3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
25
Interface Type
I2C/SPI/USART
On-chip Adc
11-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F1938-I/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
TABLE 28-2:
TABLE 28-3:
© 2009 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating Temperature
OS08
OS08A MF
OS10*
Note 1: Instruction cycle period (T
F10
F11
F12
F13*
Param
Param
No.
No.
*
2: To ensure these oscillator frequency tolerances, V
3: By design.
*
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
HF
T
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current
consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an
external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
possible. 0.1 μF and 0.01 μF values in parallel are recommended.
IOSC ST
F
F
T
Δ
Sym.
Sym.
OSC
OSC
SYS
RC
CLK
These parameters are characterized but not tested.
only and are not tested.
OSC
Oscillator Frequency Range
On-Chip VCO System Frequency
PLL Start-up Time (Lock Time)
CLKOUT Stability (Jitter)
OSCILLATOR PARAMETERS
PLL CLOCK TIMING SPECIFICATIONS (V
Internal Calibrated HFINTOSC
Frequency
Internal Calibrated MFINTOSC
Frequency
HFINTOSC
Wake-up from Sleep Start-up Time
MFINTOSC
Wake-up from Sleep Start-up Time
-40°C ≤ T
Characteristic
(2)
(2)
Characteristic
CY
A
≤ +125°C
) equals four times the input oscillator time base period. All specified values are based on
Preliminary
Tolerance
Freq.
DD
±2%
±5%
±2%
±5%
and V
SS
Min.
-0.25%
PIC16F193X/LF193X
must be capacitively decoupled as close to the device as
Min.
16
DD
4
= 2.7V TO 5.5V)
Typ†
16.0
16.0
500
500
20
5
Typ†
Max.
30
8
Units
MHz
MHz
+0.25%
kHz
kHz
μs
μs
Max.
32
8
2
0°C ≤ T
2.5V
-40°C ≤ T
2.5V
0°C ≤ T
-40°C ≤ T
Units
MHz
MHz
ms
%
DS41364C-page 373
A
A
Conditions
A
≤ +85°C, V
≤ +85°C
A
≤ +125°C, V
≤ +125°C
Conditions
DD
DD

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