ATTINY13-20MU Atmel, ATTINY13-20MU Datasheet - Page 100

• Manufacturer Part Number: ATTINY13-20MU
• Description: IC MCU AVR 1K FLASH 10MHZ 20-MLF
• Manufacturer: Atmel
• Series: AVR® ATtinyr

Specifications of ATTINY13-20MU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 6
• Program Memory Size: 1KB (512 x 16)
• Program Memory Type: FLASH
• Eeprom Size: 64 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-MLF®, QFN
• Processor Series: ATTINY1x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATAKSTK511
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 4 Channel
• Package: 20MLF EP
• Device Core: AVR
• Family Name: ATtiny
• Maximum Speed: 20 MHz
• For Use With: ATSTK600-DIP40 - STK600 SOCKET/ADAPTER 40-PDIP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVRATAVRISP2 - PROGRAMMER AVR IN SYSTEMATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Connectivity: -
• Lead Free Status / Rohs Status: Details

16.7
16.8
100
Preventing Flash Corruption
Programming Time for Flash when Using SPM
ATtiny13
To read the Fuse High Byte (FHB), simply replace the address in the Z-pointer with 0x0003 and
repeat the procedure above.
If successful, the contents of the destination register are as follows.
See sections
for more information on fuse and lock bits.
During periods of low V
too low for the CPU and the Flash to operate properly. These issues are the same as for board
level systems using the Flash, and the same design solutions should be applied.
A Flash program corruption can be caused by two situations when the voltage is too low. First, a
regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly,
the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions
is too low.
Flash corruption can easily be avoided by following these design recommendations (one is
sufficient):
The calibrated RC Oscillator is used to time Flash accesses.
typical programming time for Flash accesses from the CPU.
Table 16-1.
Note:
Bit
Rd
Flash write (Page Erase, Page Write, and
write lock bits by SPM)
1. Keep the AVR RESET active (low) during periods of insufficient power supply voltage.
2. Keep the AVR core in Power-down sleep mode during periods of low V
This can be done by enabling the internal Brown-out Detector (BOD) if the operating
voltage matches the detection level. If not, an external low V
can be used. If a reset occurs while a write operation is in progress, the write operation
will be completed provided that the power supply voltage is sufficient.
vent the CPU from attempting to decode and execute instructions, effectively protecting
the SPMCSR Register and thus the Flash from unintentional writes.
1. The min and max programming times is per individual operation.
“Program And Data Memory Lock Bits” on page 102
SPM Programming Time
FHB7
Symbol
7
CC
FHB6
, the Flash program can be corrupted because the supply voltage is
6
FHB5
5
(1)
Min Programming Time
FHB4
4
3.7 ms
FHB3
3
Table 16-1 on page 100
FHB2
2
and
CC
reset protection circuit
Max Programming Time
“Fuse Bytes” on page 103
FHB1
1
CC
4.5 ms
. This will pre-
FHB0
0
2535J–AVR–08/10
shows the