MT9LSDT1672AY-133G3 Micron Technology Inc, MT9LSDT1672AY-133G3 Datasheet - Page 16

• Manufacturer Part Number: MT9LSDT1672AY-133G3
• Description: MODULE SDRAM 128MB 168-DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT9LSDT1672AY-133G3

• Memory Type: SDRAM
• Memory Size: 128MB
• Speed: 133MHz
• Package / Case: 168-DIMM
• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168UDIMM
• Device Core Size: 72b
• Organization: 16Mx72
• Total Density: 128MByte
• Chip Density: 128Mb
• Access Time (max): 6/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 1.35A
• Number Of Elements: 9
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 16: Electrical Characteristics and Recommended AC Operating Conditions
Notes: 5, 6, 8, 9, 11, 31; notes appear on page 18
Module AC timing parameters comply with PC100 and PC133 Design Specs, based on component parameters
09005aef807b3709
SD9_18C16_32x72AG.fm - Rev. E 6/04 EN
ACCHARACTERISTICS
PARAMETER
Access timefrom CLK (pos.edge) CL= 3
Address hold time
Address setup time
CLK high-level width
CLK low-level width
Clock cycle time
CKE holdt ime
CKE setup time
CS#, RAS#, CAS#, WE#, DQM hold time
CS#, RAS#, CAS#, WE#, DQM setup time
Data-in hold time
Data-in setup time
Data-out high-impedance time
Data-out low-impedance time
Data-out hold time (load)
Data-out hold time (noload)
ACTIVE to PRECHARGE command
ACTIVE to ACTIVE command period
ACTIVE to READ or WRITE delay
Refresh period (4,096 rows)
AUTOREFRESH period
PRECHARGE command period
ACTIVE bank a to ACTIVE bank b
command
Transition time
WRITE recovery time
Exit SELF REFRESH to ACTIVE command
CL= 2
CL= 3
CL = 2
CL = 3
CL = 2
SYMBOL
t
t
128MB (x72, ECC, SR), 256MB (x72, ECC, DR)
t
t
t
t
t
t
AC(3)
AC(2)
t
t
t
t
CK(3)
CK(2)
HZ(3)
HZ(2)
t
t
CMH
t
t
t
t
t
CMS
t
t
t
CKH
OH
RCD
RRD
t
CKS
t
RAS
t
t
XSR
t
t
REF
RFC
OH
WR
AH
DH
CH
AS
DS
RC
RP
t
CL
LZ
T
N
1 CLK
MIN
7ns
0.8
1.5
2.5
2.5
7.5
0.8
1.5
0.8
1.5
0.8
1.5
1.8
0.3
37
60
15
66
15
14
14
67
7
1
3
+
-13E
16
120,000
MAX
5.4
5.4
5.4
5.4
1.2
64
.
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1 CLK
7.5ns
MIN
0.8
1.5
2.5
2.5
7.5
0.8
1.5
0.8
1.5
0.8
1.5
1.8
0.3
10
44
66
20
66
20
15
15
75
1
3
+
-133
120,000
168-PIN SDRAM UDIMM
MAX
5.4
5.4
1.2
64
6
6
1 CLK
MIN
7ns
1.8
0.3
10
50
70
20
70
20
20
15
80
+
1
2
3
3
8
1
2
1
2
1
2
1
3
-10E
120,000
MAX
1.2
64
6
6
6
6
©2004 Micron Technology, Inc.
UNITS
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTES
27
23
23
10
10
28
32
24
25
20
7