MT4VDDT3264HY-335F2 Micron Technology Inc, MT4VDDT3264HY-335F2 Datasheet - Page 20

• Manufacturer Part Number: MT4VDDT3264HY-335F2
• Description: MODULE DDR 256MB 200-SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT4VDDT3264HY-335F2

• Memory Type: DDR SDRAM
• Memory Size: 256MB
• Speed: 333MT/s
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 32Mx64
• Total Density: 256MByte
• Chip Density: 512Mb
• Access Time (max): 700ps
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 780mA
• Number Of Elements: 4
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1231; MT4VDDT3264HY-335F2

pdf: 09005aef8086ea3d, source: 09005aef8086ea0b
DD4C8_16_32x64HG.fm - Rev. C 9/04 EN
22. The valid data window is derived by achieving
23. Each byte lane has a corresponding DQS.
24. This limit is actually a nominal value and does not
25. To maintain a valid level, the transitioning edge of
once every 140.6µs (64MB) or 70.3µs (128MB,
256MB); burst refreshing or posting by the DRAM
controller greater than eight refresh cycles is not
allowed.
other specifications:
(
directly porportional with the clock duty cycle
and a practical data valid window can be derived.
The clock is allowed a maximum duty cycle varia-
tion of 45/55, beyond which functionality is
uncertain. Figure 8, Derating Data Valid Window
(
vided below for duty cycles ranging between 50/
50 and 45/55.
result in a fail value. CKE is HIGH during RE-
FRESH command period (
LOW (i.e., during standby).
t
t
QH =
QH -
3.8
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
t
HP -
t
DQSQ), shows derating curves are pro-
50/50
3.750
2.500
t
QHS). The data valid window derates
NA
49.5/50.5
3.700
-335
-262/-26A/-265 @
-262/-26A/-265 @
t
2.463
HP (
t
Figure 8: Derating Data Valid Window
t
CK/2),
RFC [MIN]) else CKE is
49/51
3.650
2.425
t
t
CK = 10ns
CK = 7.5ns
t
DQSQ, and
48.5/52.5
3.600
2.388
(
t
3.550
48/52
t
QH
QH -
2.350
Clock Duty Cycle
20
t
DQSQ)
47.5/53.5
3.500
26. JEDEC specifies CK and CK# input slew rate must
27. DQ and DM input slew rates must not deviate
28. V
29. The clock is allowed up to ±150ps of jitter. Each
2.313
64MB, 128MB, 256MB (x64, SR)
200-PIN DDR SDRAM SODIMM
the input must:
be 1V/ns (2V/ns differentially).
from DQS by more than 10 percent. If the DQ/
DM/DQS slew rate is less than 0.5 V/ns, timing
must be derated: 50ps must be added to
t
slew rate exceeds 4 V/ns, functionality is uncer-
tain. For -335, slew rates must be 0.5 V/ns.
not active while any device bank is active.
timing parameter is allowed to vary by the same
amount.
b. Reach at least the target AC level.
a. Sustain a constant slew rate from the current
c. After the AC target level is reached, continue to
DH for each 100 mv/ns reduction in slew rate. If
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD
AC level through to the target AC level, V
or V
maintain at least the target DC level, V
or V
3.450
47/53
must not vary more than 4 percent if CKE is
2.275
IH
IH
(AC).
(DC).
46.5/54.5
3.400
2.238
3.350
46/54
2.200
©2004 Micron Technology, Inc. All rights reserved.
45.5/55.5
3.300
2.163
3.250
45/55
2.125
t
DS and
IL
IL
(DC)
(AC)