TLE6230GP Infineon Technologies, TLE6230GP Datasheet - Page 4

• Manufacturer Part Number: TLE6230GP
• Description: IC SW SMART OCTAL LOWSIDE PDSO36
• Manufacturer: Infineon Technologies
• Type: Low Sider

Specifications of TLE6230GP

• Input Type: SPI
• Number Of Outputs: 8
• On-state Resistance: 800 mOhm
• Current - Peak Output: 1.5A
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: DSO-36
• Switch Type: Low Side
• Power Switch Family: TLE6230
• Input Voltage: -0.3 to 7V
• Power Switch On Resistance: 800mOhm
• Output Current: 1A
• Mounting: Surface Mount
• Supply Current: 1mA
• Package Type: DSO
• Operating Temperature (min): -40C
• Operating Temperature (max): 150C
• Operating Temperature Classification: Automotive
• Pin Count: 38
• Power Dissipation: 3300W
• Packages: PG-DSO-36
• Thermal Class: Heatslug down
• Id Nom: 8 x 0.5 A
• Channels: 8.0
• Comment: relay driver and general purpose
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Compliant
• Other names: SP000012169; SP000691114; TLE6230GP; TLE6230GPNT; TLE6230GPT; TLE6230GPT; TLE6230GPTR

Minimum footprint
Maximum Ratings for T
Parameter
Supply Voltage
Continuous Drain Source Voltage (OUT1...OUT8)
Input Voltage, All Inputs and Data Lines
Load Dump Protection V
With Automotive Relay Load R
R I
With R
Operating Temperature Range
Storage Temperature Range
Output Current per Channel (see el. characteristics)
Output Current per Channel @ T
(All 8 Channels ON; Mounted on PCB )
Output Clamping Energy (single pulse)
I
Power Dissipation (mounted on PCB) @ T
Electrostatic Discharge Voltage (Human Body Model)
according to MIL STD 883D, method 3015.7 and EOS/ESD
assn. standard S5.1 – 1993
Output 1-8 Pins
All other Pins
DIN Humidity Category, DIN 40 040
IEC Climatic Category, DIN IEC 68-1
Thermal Resistance
junction - case
junction - ambient @ min. footprint
junction - ambient @ 6 cm
1
2
3
V2.3
D
) R
) V
) Output current rating so long as maximum junction temperature is not exceeded. At T
1
current has to be calculated using R
= 0.5 A
) =2 Ω; t
LoadDump
I
=internal resistance of the load dump test pulse generator LD200
L
= 24 Ω; R I =2 Ω; t d =400ms; IN = high or low
d =400ms; IN = low or high
is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839.
Load Dump
2
cooling area with heat pipes
L
j
= 70 Ω
= U P +U S ; U P =13.5 V
A
= – 40°C to 150°C
= 25°C
thJA
according mounting conditions.
3
)
A
= 25°C
Page
PCB with heat pipes,
backside 6 cm
4
Symbol
V
V
V
V
T
T
I
I
R
R
D(lim)
D
E
P
V
V
j
stg
S
DS
IN
Load Dump
thJC
thJA
AS
tot
ESD
ESD
2
Data Sheet TLE 6230 GP
cooling area
2
)
Values
-0.3 ... + 7
40
- 0.3 ... + 7
80
52
- 40 ... + 150
- 55 ... + 150
500
50
3.3
2000
2000
E
40/150/56
5
50
38
I
D(lim) min
A
= 125 °C the output
18. Nov. 2009
K/W
Unit
°C
mA
V
A
mJ
V
V
V
W
V
V