HS9-82C37ARH/SAMPLE HARRIS [Harris Corporation], HS9-82C37ARH/SAMPLE Datasheet - Page 10

• Manufacturer Part Number: HS9-82C37ARH/SAMPLE
• Description: Radiation Hardened CMOS High Performance Programmable DMA Controller
• Manufacturer: HARRIS [Harris Corporation]

Harris Space Level Product Flow -Q
Wafer Lot Acceptance (All Lots) Method 5007
GAMMA Radiation Verification (Each Wafer) Method 1019,
100% Die Attach
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
CSI and/or GSI PreCap (Note 6)
100% Temperature Cycle, Method 1010, Condition C,
100% Constant Acceleration, Method 2001, Condition per
100% PIND, Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In 1, Condition A or B, 72 Hours Min,
NOTES:
1. Failures from subgroup 1, 7 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
2. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
3. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
4. Group B and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
5. Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the
6. CSI and/or GSI inspections are optional and will not be performed unless required by theP.O. When required, the P.O. should include
7. Data Package Contents:
failures from subgroup 7.
separate line items for Group B Test, Group B Samples, Group D Test and Group D Samples.
P.O. should include a separate line item for Group D Generic Data. Generic data is not guaranteed to be available and is therefore not
available in all cases.
separate line items for CSI PreCap inspection, CSI final inspection, GSI PreCap inspection, and/or GSI final inspection.
• Cover Sheet (Harris Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Harris Part Number, Lot Number, Quantity).
• Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test
• X-Ray report and film. Includes penetrometer measurements.
• Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
• Lot Serial Number Sheet (Good units serial number and lot number).
• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
• Group B and D attributes and/or Generic data is included when required by the P.O.
• The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
equipment, etc. Radiation Read and Record data on file at Harris.
by an authorized Quality Representative.
(Includes SEM)
2 Samples/Wafer, 0 Rejects
10 Cycles
Method 5004
+125
o
C Min, Method 1015
HS-82C37ARH
10
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% PDA 1, Method 5004 (Note 1)
100% Dynamic Burn-In, Condition D, 240 Hours, +125
100% Interim Electrical Test 2(T2)
100% Delta Calculation (T0-T2)
100% PDA 2, Method 5004 (Note 1)
100% Final Electrical Test
100% Fine/Gross Leak, Method 1014
100% Radiographic (X-Ray), Method 2012 (Note 2)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 3)
Sample - Group B, Method 5005 (Note 4)
Sample - Group D, Method 5005 (Notes 4 and 5)
100% Data Package Generation (Note 7)
CSI and/or GSI Final (Note 6)
Equivalent, Method 1015
Spec Number
518058
o
C or