mt18hvs25672rhy-667 Micron Semiconductor Products, mt18hvs25672rhy-667 Datasheet

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mt18hvs25672rhy-667

Manufacturer Part Number
mt18hvs25672rhy-667
Description
2gb X72, Dr 200-pin Ddr2 Sdram Vlp Sordimm
Manufacturer
Micron Semiconductor Products
Datasheet
Table 1:
DDR2 SDRAM VLP SORDIMM
MT18HVS25672RH – 2GB
For component data sheets, refer to Micron’s Web site:
Features
• 200-pin, very low profile small outline, registered,
• Fast data transfer rates: PC2-3200, PC2-4200
• 2GB (256 Meg x 72)
• Supports ECC error detection and correction
• V
• V
• JEDEC standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Multiple internal device banks for concurrent
• Programmable CAS# latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths: 4 or 8
• Adjustable data-output drive strength
• 64ms, 8,192-cycle refresh
• On-die termination (ODT)
• Serial presence-detect (SPD) with EEPROM
• PLL to reduce system clock line loading
• Gold edge contacts
• Dual rank
• I
PDF: 09005aef82882ad5/Source: 09005aef82882b0e
HVS18C_256x72RH.fm - Rev. B 5/08 EN
Speed
Grade
dual in-line memory module (VLP SORDIMM)
or PC2-5300
operation
2
-667
-53E
-40E
DD
DDSPD
C temperature sensor
= V
DD
= +3.0V to +3.6V
Q = +1.8V
Key Timing Parameters
Products and specifications discussed herein are subject to change by Micron without notice.
Nomenclature
Industry
PC2-5300
PC2-4200
PC2-3200
t
CL = 6
CK
Data Rate (MT/s)
CL = 5
667
2GB (x72, DR) 200-Pin DDR2 SDRAM VLP SORDIMM
http://www.micron.com
1
CL = 4
533
533
400
Figure 1:
Notes: 1. Contact Micron for industrial temperature
Options
• Operating temperature
• Package
• Frequency/CAS latency
• PCB height
PCB height 17.9mm (0.70in)
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 200-pin DIMM (Pb-free)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
– 5.0ns @ CL = 3 (DDR2-400)
– 17.9mm (0.70in)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. CL = CAS (READ) latency; registered mode
3. Not recommended for new designs.
CL = 3
400
400
400
module offerings.
will add one clock cycle to CL.
200-Pin VLP SORDIMM (MO-224)
t
(ns)
RCD
15
15
15
A
A
1
2
≤ +85°C)
≤ +70°C)
©2007 Micron Technology, Inc. All rights reserved.
3
(ns)
t
15
15
15
RP
Marking
Features
None
-53E
-40E
-667
Y
I
(ns)
t
55
55
55
RC

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mt18hvs25672rhy-667 Summary of contents

Page 1

... MT18HVS25672RH – 2GB For component data sheets, refer to Micron’s Web site: Features • 200-pin, very low profile small outline, registered, dual in-line memory module (VLP SORDIMM) • Fast data transfer rates: PC2-3200, PC2-4200 or PC2-5300 • 2GB (256 Meg x 72) • Supports ECC error detection and correction • ...

Page 2

... Notes: 1. Data sheets for the base devices can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown), designating component and PCB revisions. Consult factory for current revision codes. Example: MT18HVS25672RHY-667E1. PDF: 09005aef82882ad5/Source: 09005aef82882b0e HVS18C_256x72RH.fm - Rev. B 5/08 EN ...

Page 3

Pin Assignments and Descriptions Table 4: Pin Assignments 200-Pin VLP SORDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ18 101 REF 3 DQ0 53 DQ19 103 105 DQ1 ...

Page 4

... DQ and DQS pins. SCL Input Serial clock: SCL is used to synchronize the presence-detect and temperature sensor data (SSTL_18) transfer to and from the module. SA0–SA1 Input Serial address inputs: These pins are used to configure the presence-detect and (SSTL_18) temperature sensor devices. ...

Page 5

Functional Block Diagram Figure 2: Functional Block Diagram RS1# RS0# DQS0# DQS0 DM0 DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ DQS1# DQS1 DM1 DQ8 DQ DQ9 DQ DQ10 DQ DQ11 DQ ...

Page 6

... DDR2 SDRAM modules incorporate serial presence-detect (SPD). The SPD function is implemented using a 2,048-bit EEPROM. This nonvolatile storage device contains 256 bytes. The first 128 bytes are programmed by Micron to identify the module type and various SDRAM organizations and timing parameters. The remaining 128 bytes of storage are available for use by the customer ...

Page 7

... Electrical Specifications Stresses greater than those listed in Table 6, may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions above those indicated in each device's data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli- ability ...

Page 8

I Specifications DD Table 8: DDR2 I Specifications and Conditions – 2GB DD Values shown for MT47H256M8THN DDR2 SDRAM only and are computed from values specified in the TM 2Gb TwinDie (256 Meg x 8) component data sheet. Parameter/Condition Operating ...

Page 9

... Timing and switching specifications for the register listed above are critical for proper oper- ation of the DDR2 SDRAM registered DIMMs. These are meant subset of the param- eters for the specific device used on the module. Detailed information for this register is available in JEDEC standard JESD82. ...

Page 10

Table 10: PLL Specifications CUA845 device or JESD82-21 equivalent Parameter Symbol DC high-level input voltage V DC low-level input voltage V V Input voltage (limits) V Input differential-pair cross voltage Input differential voltage V ID Input differential voltage V ID ...

Page 11

... Temperature Sensor The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I the JEDEC standard JESD21-C, page 4.7-1. Table 12: Temperature Sensor Specifications All voltages referenced to V Parameter/Condition Supply voltage Average operating supply current Input high voltage: Logic 1; All inputs Input low voltage: Logic 0 ...

Page 12

... SM Bus Slave Subaddress Decoding The temperature sensor’s physical address differs from the module’s SPD device physical addresses: 0011 for A0, A1, A2, and RW# in binary where A2, A1, and A0 are the three slave subaddress pins and the RW# pin is the READ/WRITE flag. ...

Page 13

Table 14: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register Alarm temperature lower boundary register Critical temperature register Temperature register Pointer Register The pointer register selects which of the 16-bit registers is being ...

Page 14

Table 18: Capability Register Bit Descriptions Bit Description 1 Accuracy 0: ±2°C over the active range and ±3°C over the monitor range 1: ±1°C over the active range and ±2°C over the monitor range 2 Wider range 0: Temperatures lower ...

Page 15

Table 20: Configuration Register Bit Descriptions (continued) Bit Description 7 Critical trip lock bit 0: Critical trip is not locked and can be changed 1: Critical trip is locked and can not be changed 8 Shutdown mode 0: Enabled 1: ...

Page 16

Temperature Format The temperature trip point registers and temperature readout register use a “2’s complement” format to enable negative numbers. The least significant bit is equal to 0.0625°C or 0.25°C depending on which register is referenced example, assuming ...

Page 17

Temperature Register The temperature register is a read-only register that provides the current temperature detected by the temperature sensor. The least significant bit for this register is 0.0625°C with a resolution of 0.0625°C. The most significant bit is 128°C in ...

Page 18

Serial Presence-Detect Table 27: Serial Presence-Detect EEPROM and Temperature Sensor DC Operating Conditions All voltages referenced to V Parameter/Condition Supply voltage with temperature sensor option Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output ...

Page 19

... Number of SPD bytes used by Micron 1 Total number of bytes in SPD device 2 Fundamental memory type 3 Number of row addresses on assembly 4 Number of column addresses on assembly 5 DIMM height and module ranks 6 Module data width 7 Reserved 8 Module voltage interface levels t 9 SDRAM cycle time, CK (CL = MAX value, see byte 18) ...

Page 20

... Optional features, not supported 62 SPD revision 63 Checksum for bytes 0–62 64 Manufacturer’s JEDEC ID code 65–71 Manufacturer’s JEDEC ID code 72 Manufacturing location 73–90 Module part number (ASCII) 91 PCB identification code 92 Identification code (continued) 93 Year of manufacture in BCD 94 Week of manufacture in BCD 95–98 Module serial number 99–127 Reserved for manufacturer-specific data 128– ...

Page 21

... U11 U12 4.2 (0.165) TYP 47.4 (1.87) 11.4 (0.45) TYP TYP 16.25 (0.64) ® their respective owners. Micron Technology, Inc., reserves the right to change products or specifications without notice. 21 Module Dimensions U7 18.00 (0.708) 17.80 (0.701) 10.0 (0.394) TYP PIN 199 PIN 2 TYP ©2007 Micron Technology, Inc. All rights reserved. 3.80 (0.150) MAX 1.10 (0.043) ...

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