hip6301vcbza-t Intersil Corporation, hip6301vcbza-t Datasheet - Page 19

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hip6301vcbza-t

Manufacturer Part Number
hip6301vcbza-t
Description
Microprocessor Core Voltage Regulator Multiphase Buck Pwm Controller
Manufacturer
Intersil Corporation
Datasheet
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
feature must be located within the crosshatched area.
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
19
H
A1
µ
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
HIP6301V, HIP6302V
M
o
C
M16.15
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
C
D
H
N
α
A
B
E
e
h
L
(JEDEC MS-012-AC ISSUE C)
0.0532
0.0040
0.013
0.0075
0.3859
0.1497
0.2284
0.0099
0.016
MIN
0
0.050 BSC
o
INCHES
16
0.0688
0.0098
0.020
0.0098
0.3937
0.1574
0.2440
0.0196
0.050
MAX
8
o
MILLIMETERS
1.35
0.10
0.33
0.19
9.80
3.80
5.80
0.25
0.40
MIN
0
o
1.27 BSC
16
10.00
MAX
1.75
0.25
0.51
0.25
4.00
6.20
0.50
1.27
8
December 27, 2004
o
Rev. 0 12/93
NOTES
FN9034.2
9
3
4
5
6
7
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