adsp-bf561wbbz-5a Analog Devices, Inc., adsp-bf561wbbz-5a Datasheet - Page 63

• Manufacturer Part Number: adsp-bf561wbbz-5a
• Description: Blackfin Embedded Symmetric Multi-processor
• Manufacturer: Analog Devices, Inc.

SURFACE MOUNT DESIGN
Table 39
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 39. BGA Data for Use with Surface Mount Design
Package
256-Ball CSP_BGA (BC-256-1)
256-Ball CSP_BGA (BC-256-4)
297-Ball PBGA (B-297)
is provided as an aid to PCB design. For industry-
A1 BALL
PAD CORNER
2.43
2.23
2.03
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MS-034, VARIATION AAL-1.
3. MINIMUM BALL HEIGHT 0.40
SIDE VIEW
TOP VIEW
27.00 BSC SQ
Figure 54. 297-Ball Plastic Ball Grid Array (PBGA) (B-297)
DETAIL A
Rev. C | Page 63 of 64 | December 2007
Ball Attach Type
Solder Mask Defined
Solder Mask Defined
Solder Mask Defined
1.00 BSC
BALL PITCH
BALL DIAMETER
0.20 MAX
COPLANARITY
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
26
25
24
23
22
0.70
0.60
0.50
21
Solder Mask Opening
0.30 mm diameter
0.43 mm diameter
0.43 mm diameter
20
19
18
17
BOTTOM VIEW
16
25.00 BSC SQ
15
DETAIL A
8.00
14
CL
13
12
11
10
9
8
7
6
5
4
SEATING PLANE
3
2
0.40 MIN
1
Ball Pad Size
0.43 mm diameter
0.55 mm diameter
0.58 mm diameter
8.00
A1 BALL
PAD CORNER
ADSP-BF561
CL