AM29DL323GT90WMI AMD (ADVANCED MICRO DEVICES), AM29DL323GT90WMI Datasheet - Page 97
AM29DL323GT90WMI
Manufacturer Part Number
AM29DL323GT90WMI
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.AM29DL323GT90WMI.pdf
(100 pages)
Specifications of AM29DL323GT90WMI
Lead Free Status / Rohs Status
Not Compliant
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March 15, 2004 31107A5
VBH064—64-Ball Fine-pitch Ball Grid Array 8 x 11.6 mm package
(PL127J)
PACKAGE
JEDEC
SYMBOL
A
SD / SE
0.05
(2X)
MD
ME
A1
A2
D1
E1
φb
A
D
E
N
e
A1
C
INDEX MARK
A1 CORNER
0.18
0.62
0.33
MIN
11.60 mm x 8.00 mm NOM
M2-9,C10-K10,L1-4,L7-10,
---
(A2-9,B1-4,B7-10,C1-K1,
11.60 BSC.
PACKAGE
G5-6,F5-6)
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
VBH 064
NOM
N/A
10
---
---
---
12
10
64
---
TOP VIEW
SIDE VIEW
MAX
1.00
0.76
0.43
D
---
P R E L I M I N A R Y
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
SEATING PLANE
S29PL127J/S29PL129J/S29PL064J/S29PL032J
NOTE
A2
A
0.05
(2X)
E
C
B
C
0.08
0.10 C
e
C
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
NXφb
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
6
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
e
φ 0.08 M
φ 0.15
M
M
L
C
C A
K
B
J
BOTTOM VIEW
H
G
D1
F
SD
E
D
7
C
B
A
10
9
8
7
6
5
4
3
2
1
3330 \ 16-038.25b
A1 CORNER
SE
7
E1
97
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