AM29DL323GT90WMI AMD (ADVANCED MICRO DEVICES), AM29DL323GT90WMI Datasheet - Page 17

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AM29DL323GT90WMI

Manufacturer Part Number
AM29DL323GT90WMI
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet

Specifications of AM29DL323GT90WMI

Lead Free Status / Rohs Status
Not Compliant
March 15, 2004 31107A5
56-Ball Fine-pitch BGA 7x9 mm Configuration
For this family of products, a single multi-chip compatible package is offered for
each density to allow both standalone and multi-chip qualification using a single,
adaptable package. This new methodology allows package standardization
resulting in faster development. The multi-chip compatible package includes all
the pins required for standalone device operation and verification. In addition,
extra pins are included for insertion of common data storage or logic devices to
be used for multi-chip products. If a standalone device is required, the extra
multi-chip specific pins are not connected and the standalone device operates
normally. The multi-chip compatible package sizes were chosen to serve the
CE1#f
RFU
G1
A3
B1
C1
A2
D1
A0
F1
A1
E1
DQ0
DQ8
VSS
OE#
A7
B2
A5
A2
C2
G2
H2
A6
D2
A4
E2
F2
P R E L I M I N A R Y
S29PL127J/S29PL129J/S29PL064J/S29PL032J
DQ10
Top View, Balls Facing Down
RFU
A18
DQ1
DQ9
DQ2
A17
RFU
A3
C3
F3
G3
B3
D3
E3
H3
56-Ball Fine-pitch BGA
RY/BY#
WP/ACC
RST#
VCCf
DQ11
DQ3
B4
C4
G4
H4
A4
F4
WE#
DQ4
RFU
A20
RFU
RFU
A5
B5
G5
C5
F5
H5
DQ13
DQ12
DQ5
A10
DQ6
A19
A8
A9
G6
A6
F6
H6
B6
C6
D6
E6
DQ15
DQ14
DQ7
A11
A12
A13
A14
RFU
A7
G7
C7
D7
E7
F7
H7
B7
A15
RFU
A16
VSS
RFU
G8
C8
A21
D8
E8
B8
F8
17

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