P82B96TD,118 NXP Semiconductors, P82B96TD,118 Datasheet - Page 29

• Manufacturer Part Number: P82B96TD,118
• Description: IC I2C BUS BUFFER DUAL 8-SOIC
• Manufacturer: NXP Semiconductors
• Type: Bufferr

Specifications of P82B96TD,118

• Package / Case: 8-SOIC (3.9mm Width)
• Tx/rx Type: I²C Logic
• Delay Time: 5.0ns
• Capacitance - Input: 7pF
• Voltage - Supply: 2 V ~ 15 V
• Current - Supply: 900µA
• Mounting Type: Surface Mount
• Number Of Channels Per Chip: Dual
• Supply Voltage (max): 15 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Logic Type: Bidirectional Bus Buffer
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6285 - EVAL BOARD I2C-2002-1A568-4002 - DEMO BOARD I2C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1009-2; 935262295118; P82B96TD-T

NXP Semiconductors
14. Abbreviations
P82B96_8
Product data sheet
13.4 Package related soldering information
Table 9.
[1]
[2]
Table 10.
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Acronym
CDM
DDC
ESD
HBM
IC
I
MM
SMBus
2
C-bus
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Abbreviations
Description
Charged Device Model
Display Data Channel
ElectroStatic Discharge
Human Body Model
Integrated Circuit
Inter IC bus
Machine Model
System Management Bus
Rev. 08 — 10 November 2009
Soldering method
Dipping
-
suitable
-
Dual bidirectional bus buffer
Wave
suitable
suitable
not suitable
© NXP B.V. 2009. All rights reserved.
P82B96
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