P82B96TD,118 NXP Semiconductors, P82B96TD,118 Datasheet - Page 27

• Manufacturer Part Number: P82B96TD,118
• Description: IC I2C BUS BUFFER DUAL 8-SOIC
• Manufacturer: NXP Semiconductors
• Type: Bufferr

Specifications of P82B96TD,118

• Package / Case: 8-SOIC (3.9mm Width)
• Tx/rx Type: I²C Logic
• Delay Time: 5.0ns
• Capacitance - Input: 7pF
• Voltage - Supply: 2 V ~ 15 V
• Current - Supply: 900µA
• Mounting Type: Surface Mount
• Number Of Channels Per Chip: Dual
• Supply Voltage (max): 15 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Logic Type: Bidirectional Bus Buffer
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6285 - EVAL BOARD I2C-2002-1A568-4002 - DEMO BOARD I2C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1009-2; 935262295118; P82B96TD-T

NXP Semiconductors
P82B96_8
Product data sheet
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 7.
Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
8
Rev. 08 — 10 November 2009
28.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
28) than a SnPb process, thus
220
220
Dual bidirectional bus buffer
350
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
P82B96
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