GCM32DR72A225KA64L Murata, GCM32DR72A225KA64L Datasheet - Page 42

• Manufacturer Part Number: GCM32DR72A225KA64L
• Description: Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1210 2.2uF 100volts X7R +/-10%
• Manufacturer: Murata
• Series: GCMr

Specifications of GCM32DR72A225KA64L

• Capacitance: 2.2 uF
• Tolerance: 10 %
• Voltage Rating: 100 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Package / Case: 1210 (3225 metric)
• Product: Automotive MLCCs
• Dimensions: 2.5 mm W x 3.2 mm L x 2 mm H
• Dissipation Factor Df: 0.01
• Termination Style: SMD/SMT
• Lead Free Status / Rohs Status: Details

2
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Vibration and Impact
2. Circuit Board Material
3. Land Layout for Cropping PC Board
40
<Examples to be avoided>
!Caution
[Component Direction]
Solder and Mounting
Do not expose a capacitor to excessive shock or vibration
during use.
In case that ceramic chip capacitor is soldered on the
metal board, such as Aluminum board, the stress of heat
expansion and contraction might cause the crack of
ceramic capacitor, due to the difference of thermal
expansion coefficient between metal board and ceramic
chip.
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
<Examples of improvements>
Locate chip
horizontal to the
direction in which
stress acts.
[Chip Mounting Close to Board Separation Point]
Perforation
A
Slit
B
D
C
Continued on the following page.
Chip arrangement
Worst AGCGB~D Best
C03E.pdf
09.3.31