GCM32DR72A225KA64L Murata, GCM32DR72A225KA64L Datasheet - Page 29

• Manufacturer Part Number: GCM32DR72A225KA64L
• Description: Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1210 2.2uF 100volts X7R +/-10%
• Manufacturer: Murata
• Series: GCMr

Specifications of GCM32DR72A225KA64L

• Capacitance: 2.2 uF
• Tolerance: 10 %
• Voltage Rating: 100 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Package / Case: 1210 (3225 metric)
• Product: Automotive MLCCs
• Dimensions: 2.5 mm W x 3.2 mm L x 2 mm H
• Dissipation Factor Df: 0.01
• Termination Style: SMD/SMT
• Lead Free Status / Rohs Status: Details

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
(2) Land Dimensions
Table 1 Flow Soldering Method
Table 2 Reflow Soldering Method
2. Adhesive Application
3. Adhesive Curing
Part Number
Part Number
GCM18
GCM21
GCM31
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
GCM18
GCM21
GCM31
Inverting the PCB
Thin or insufficient adhesive causes chips to loosen or
Low viscosity adhesive causes chips to slip after
Adhesive Coverage*
Excessive amount of solder gives much stress to the
components. Appropriate land pattern size can reduce
the amount of solder and the mechanical stress to the
components. Recommended land pattern dimension for
flow and reflow are shown in Table 1 and Table 2
respectively.
become disconnected when flow soldered.
The amount of adhesive must be more than dimension c
shown in the drawing below to obtain enough bonding
strength.
The chip's electrode thickness and land thickness must
be taken into consideration.
mounting. Adhesive must have a viscosity of
5000Pa
Insufficient curing of the adhesive causes chips to
disconnect during flow soldering and causes deteriorated
insulation resistance between outer electrodes due to
moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
Make sure not to impose an abnormal mechanical shock on the PCB.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number
•
s (500ps) min. (at 25 C)
Dimensions
Dimensions
Dimensions (LgW)
Dimensions (LgW)
2.0g1.25
2.0g1.25
1.6g0.8
3.2g1.6
0.6g0.3
1.0g0.5
1.6g0.8
3.2g1.6
3.2g2.5
Adhesive Coverage
0.05mg min.
0.15mg min.
0.1mg min.
*
Nominal Value
*
0.6e1.0
1.0e1.2
2.2e2.6
0.2e0.3
0.3e0.5
0.6e0.8
1.0e1.2
2.2e2.4
2.0e2.4
a
a
Board
c
b
0.35e0.45
0.2e0.35
0.8e0.9
0.9e1.0
1.0e1.1
0.6e0.7
0.6e0.7
0.8e0.9
1.0e1.2
Chip Capacitor
b
b
Chip Capacitor
a
Land
Adhesive
Continued on the following page.
Land
a : 20 to 70 m
b : 30 to 35 m
c : 50 to 105 m
Solder Resist
0.6e0.8
0.8e1.1
1.0e1.4
0.2e0.4
0.4e0.6
0.6e0.8
0.8e1.1
1.0e1.4
1.8e2.3
a
b
c
c
Notice
in section
(in mm)
(in mm)
c
C03E.pdf
27
09.3.31
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