GCM32DR72A225KA64L Murata, GCM32DR72A225KA64L Datasheet - Page 35

• Manufacturer Part Number: GCM32DR72A225KA64L
• Description: Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1210 2.2uF 100volts X7R +/-10%
• Manufacturer: Murata
• Series: GCMr

Specifications of GCM32DR72A225KA64L

• Capacitance: 2.2 uF
• Tolerance: 10 %
• Voltage Rating: 100 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Package / Case: 1210 (3225 metric)
• Product: Automotive MLCCs
• Dimensions: 2.5 mm W x 3.2 mm L x 2 mm H
• Dissipation Factor Df: 0.01
• Termination Style: SMD/SMT
• Lead Free Status / Rohs Status: Details

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
No.
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Continued from the preceding page.
Beam Load Test
Capacitance
Temperature
Character-
istics
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
AEC-Q200
Test Item
Capacitance
Change
Capacitance
Drift
The chip endure following force.
-750±120 ppm/°C
(Temp. Range: +25 to +125°C)
-750±120, -347 ppm/°C
(Temp. Range: -55 to +25°C)
Within ±0.5% or ±0.05 pF
(Whichever is larger)
< Chip L dimension: 2.5mm max. >
< Chip L dimension: 3.2mm min. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
Specifications
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip L dimension: 2.5mm max. >
< Chip L dimension: 3.2mm min. >
Speed supplied the Stress Load: 2.5mm / s
The capacitance change should be measured after 5 min. at
each specified temperature stage.
Specifications and Test Methods
The temperature coefficient is determined using the capacitance
measured in step 3 as a reference. When cycling the
temperature sequentially from step1 through 5 the capacitance
should be within the specified tolerance for the temperature
coefficient. The capacitance drift is calculated by dividing the
differences between the maximum and minimum measured
values in steps 1, 3 and 5 by the capacitance value in step 3.
Step
1
2
3
4
5
AEC-Q200 Test Method
Fig. 4
L
0.6 L
Temperature (°C)
125±3
-55±3
25±2
25±2
25±2
Iron Board
C03E.pdf
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