GCM32DR72A225KA64L Murata, GCM32DR72A225KA64L Datasheet - Page 26

• Manufacturer Part Number: GCM32DR72A225KA64L
• Description: Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1210 2.2uF 100volts X7R +/-10%
• Manufacturer: Murata
• Series: GCMr

Specifications of GCM32DR72A225KA64L

• Capacitance: 2.2 uF
• Tolerance: 10 %
• Voltage Rating: 100 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Package / Case: 1210 (3225 metric)
• Product: Automotive MLCCs
• Dimensions: 2.5 mm W x 3.2 mm L x 2 mm H
• Dissipation Factor Df: 0.01
• Termination Style: SMD/SMT
• Lead Free Status / Rohs Status: Details

1
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4. Leaded Component Insertion
5. Flow Soldering
Table 2
Recommended Conditions
24
Preheating Peak Temperature
!Caution
!Caution
Soldering Peak Temperature
GCM18/21/31
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Optimum Solder Amount for Flow Soldering
If the PCB is flexed when leaded components (such as
transformers and lCs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
When the sudden heat is given to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity of components inside. And an excessively long
soldering time or high soldering temperature results in
leaching of the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively big, the risk of cracking is higher during
board bending or under any other stressful conditions.
between electrodes and end termination.
In order to prevent mechanical damage in the
components, preheating should be required for both of
the components and the PCB board. Preheating
conditions are shown in table 2. It is required to keep
temperature differential between the soldering and the
components surface ( T) as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Don't apply flow soldering to chips not listed in Table 2.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Atmosphere
Part Number
Pb-Sn Solder
240-250 C
90-110 C
Air
Temperature Differential
TV150 C
Lead Free Solder
100-120 C
250-260 C
N
2
[Standard Conditions for Flow Soldering]
[Allowable Soldering Temperature and Time]
Temperature (D)
Preheating
Peak
Temperature
Soldering
Peak
Temperature
In case of repeated soldering, the accumulated
Soldering time must be within the range shown above.
280
270
260
250
240
230
220


















0



Adhesive
30-90 seconds
10
Preheating
T
20
Continued on the following page.
Soldering
Soldering Time (sec.)
5 seconds max.
30
Up to Chip Thickness
Gradual
Cooling
Time
in section
40
C03E.pdf
09.3.31