MSC8113TMP3600V Freescale Semiconductor, MSC8113TMP3600V Datasheet - Page 14

• Manufacturer Part Number: MSC8113TMP3600V
• Description: DSP TRI-CORE 431-FCPBGA
• Manufacturer: Freescale Semiconductor
• Series: MSC81xx StarCorer
• Type: SC140 Corer

Specifications of MSC8113TMP3600V

• Interface: Ethernet, I²C, TDM, UART
• Clock Rate: 300MHz
• Non-volatile Memory: External
• On-chip Ram: 1.436MB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.10V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 431-FCPBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Electrical Characteristics
2.2
Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.
2.3
Table 4 describes thermal characteristics of the MSC8113 for the FC-PBGA packages.
Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.
2.4
This section describes the DC electrical characteristics for the MSC8113. The measurements in Table 5 assume the following
system conditions:
Note: The leakage current is measured for nominal
14
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case
Junction-to-package-top
Notes:
Core and PLL supply voltage:
I/O supply voltage
Input voltage
Operating temperature range:
•
•
•
•
T
V
V
GND
1.
2.
3.
4.
5.
6.
A
DD
DDH
= 25 °C
Recommended Operating Conditions
Thermal Characteristics
DC Electrical Characteristics
= 1.1 V nominal = 1.07–1.13 V
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
= 0 V
= 3.3 V ± 5% V
5
1, 2
Characteristic
DC
6
4
Rating
MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1
DC
1, 3
Table 4. Thermal Characteristics for the MSC8113
Table 3. Recommended Operating Conditions
DC
V
Symbol
DDH
R
R
R
R
Ψ
θJC
θJA
θJA
θJB
JT
and
V
DD
Symbol
V
.
V
CCSYN
V
V
DDH
T
DD
IN
Convection
J
Natural
0.9
26
19
9
1
20
FC-PBGA
×
–0.2 to V
20 mm
3.135 to 3.465
1.07 to 1.13
–40 to 105
(1 m/s) airflow
Value
200 ft/min
5
DDH
Freescale Semiconductor
21
15
+0.2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
V
V
V