MSC8113TMP3600V Freescale Semiconductor, MSC8113TMP3600V Datasheet

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MSC8113TMP3600V

Manufacturer Part Number
MSC8113TMP3600V
Description
DSP TRI-CORE 431-FCPBGA
Manufacturer
Freescale Semiconductor
Series
MSC81xx StarCorer
Type
SC140 Corer
Datasheet

Specifications of MSC8113TMP3600V

Interface
Ethernet, I²C, TDM, UART
Clock Rate
300MHz
Non-volatile Memory
External
On-chip Ram
1.436MB
Voltage - I/o
3.30V
Voltage - Core
1.10V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
431-FCPBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MSC8113TMP3600V
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Freescale Semiconductor
Data Sheet
Tri-Core Digital Signal
Processor
• Three StarCore™ SC140 DSP extended cores, each with an
• 475 Kbyte M2 memory for critical data and temporary data
• 4 Kbyte boot ROM.
• M2-accessible multi-core MQBus connecting the M2 memory
• Internal PLL configured are reset by configuration signal values.
• 60x-compatible system bus with 64 or 32 bit data and 32-bit
• Direct slave interface (DSI) using a 32/64-bit slave host interface
• Three mode signal multiplexing: 64-bit DSI and 32-bit system
• Flexible memory controller with three UPMs, a GPCM, a
© Freescale Semiconductor, Inc., 2008. All rights reserved.
SC140 DSP core, 224 Kbyte of internal SRAM M1 memory
(1436 Kbyte total), 16 way 16 Kbyte instruction cache (ICache),
four-entry write buffer, external cache support, programmable
interrupt controller (PIC), local interrupt controller (LIC), and
low-power Wait and Stop processing modes.
buffering.
with all three cores, operating at the core frequency, with data bus
access of up to 128-bit reads and up to 64-bit writes, central
efficient round-robin arbiter for core access to the bus, and atomic
operation control of M2 memory access by the cores and the local
bus.
address bus, support for multi-master designs, four-beat burst
transfers (eight-beat in 32-bit data mode), port size of 64/32/16/8
bits controlled by the internal memory controller,.access to
external memory or peripherals, access by an external host to
internal resources, slave support with direct access to internal
resources including M1 and M2 memories, and on-device
arbitration for up to four master devices.
with 21–25 bit addressing and 32/64-bit data transfers, direct
access by an external host to internal and external resources,
synchronous or asynchronous accesses with burst capability in
synchronous mode, dual or single strobe mode, write and read
buffers to improve host bandwidth, byte enable signals for
1/2/4/8-byte write granularity, sliding window mode for access
using a reduced number of address pins, chip ID decoding to
allow one CS signal to control multiple DSPs, broadcast mode to
write to multiple DSPs, and big-endian/little-endian/munged
support.
bus, 32-bit DSI and 64-bit system bus, or 32-bit DSI and 32-bit
system bus, and Ethernet port (MII/RMII).
page-mode SDRAM machine, glueless interface to a variety of
memories and devices, byte enables for 64- or 32-bit bus widths,
• Multi-channel DMA controller with 16 time-multiplexed single
• Up to four independent TDM modules with programmable word
• Ethernet controller with support for 10/100 Mbps MII/RMII/SMII
• UART with full-duplex operation up to 6.25 Mbps.
• Up to 32 general-purpose input/output (GPIO) ports.
• I
• Two timer modules, each with sixteen configurable 16-bit timers.
• Eight programmable hardware semaphores.
• Global interrupt controller (GIC) with interrupt consolidation and
• Optional booting external memory, external host, UART, TDM,
8 memory banks for external memories, and 2 memory banks for
IPBus peripherals and internal memories.
channels, up to four external peripherals, DONE or DRACK
protocol for two external peripherals,.service for up to 16 internal
requests from up to 8 internal FIFOs per channel, FIFO generated
watermarks and hungry requests, priority-based
time-multiplexing between channels using 16 internal priority
levels or round-robin time-multiplexing between channels,
flexible channel configuration with connection to local bus or
system bus, and flyby transfer support that bypasses the FIFO.
size (2, 4, 8, or 16-bit), hardware-base A-law/μ-law conversion,
up to 128 Mbps data rate for all channels, with glueless interface
to E1 or T1 framers, and can interface with H-MVIP/H.110
devices, TSI, and codecs such as AC-97.
including full- and half-duplex operation, full-duplex flow
controls, out-of-sequence transmit queues, programmable
maximum frame length including jumbo frames and VLAN tags
and priority, retransmission after collision, CRC generation and
verification of inbound/outbound packets, address recognition
(including exact match, broadcast address, individual hash check,
group hash check, and promiscuous mode), pattern matching,
insertion with expansion or replacement for transmit frames,
VLAN tag insertion, RMON statistics, local bus master DMA for
descriptor fetching and buffer access, and optional multiplexing
with GPIO (MII/RMII/SMII) or DSI/system bus signals lines
(MII/RMII).
routing to INT_OUT, NMI_OUT, and the cores; twenty-four
virtual maskable interrupts (8 per core) and three virtual NMI (one
per core) that can be generated by a simple write access.
or I
2
C interface that allows booting from EEPROM devices.
2
C.
MSC8113
Document Number: MSC8113
FC-PBGA–431
20 mm × 20 mm
Rev. 1, 12/2008

Related parts for MSC8113TMP3600V

MSC8113TMP3600V Summary of contents

Page 1

... Ethernet port (MII/RMII). • Flexible memory controller with three UPMs, a GPCM, a page-mode SDRAM machine, glueless interface to a variety of memories and devices, byte enables for 64- or 32-bit bus widths, © Freescale Semiconductor, Inc., 2008. All rights reserved. Document Number: MSC8113 MSC8113 FC-PBGA–431 20 mm × ...

Page 2

... Figure 30.Boundary Scan (JTAG) Timing Diagram . . . . . . . . . . . . 37 Figure 31.Test Access Port Timing Diagram . . . . . . . . . . . . . . . . . 37 Figure 32.TRST Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 37 and Figure 33.Core Power Supply Decoupling Raised Together . . 16 Figure 34.V CCSYN with CLKIN Figure 35.MSC8113 Mechanical Information, 431-pin FC-PBGA DDH Package CCSYN Bypass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Freescale Semiconductor ...

Page 3

... The QBus interface includes a bus switch, write buffer, fetch unit, and a control unit that defines four QBus banks. In addition, the QBC handles internal memory contentions. Figure 2. StarCore MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor SC140 SC140 Extended Core ...

Page 4

... This section includes diagrams of the MSC8113 package ball grid array layouts and pinout allocation tables. 1.1 FC-PBGA Ball Layout Diagrams Top and bottom views of the FC-PBGA package are shown in Figure 3 and Figure 4 with their ball location index numbers. MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev Freescale Semiconductor ...

Page 5

... HD4 GND GND V DDH HD7 HD15 HD9 HD60 DDH HD14 HD12 HD10 HD63 HD59 DD AB GND HD13 HD11 HD8 HD62 HD61 MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Top View GND GND GND GND GND GND HCID3 GND ...

Page 6

... GND GND HD4 DDH DDH GND HD58 HD60 HD9 DDH DD V GND HD59 HD63 HD10 HD12 DDH HD56 HD57 HD61 HD62 HD8 HD11 Freescale Semiconductor GND DD EE0 TDI TRST TCK RST PO CONF RESET HA27 HA24 HA28 HA20 DD HA26 HA18 DD HA21 HA15 ...

Page 7

... GND C11 V DD C12 GND C13 V DD C14 GND C15 GND C16 GPIO30/TIMER2/TMCLK/SDA C17 GPIO2/TIMER1/CHIP_ID2/IRQ6 MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Des. Signal Name C18 GPIO1/TIMER0/CHIP_ID1/IRQ5/ETHTXD1 C19 GPIO7/TDM3RCLK/IRQ5/ETHTXD3 C20 GPIO3/TDM3TSYN/IRQ1/ETHTXD2 C21 GPIO5/TDM3TDAT/IRQ3/ETHRXD3 C22 GPIO6/TDM3RSYN/IRQ4/ETHRXD2 D2 TDI D3 EE0 D4 EE1 ...

Page 8

... CS1 G18 BCTL0 G19 GPIO15/TDM1TSYN/DREQ1 G20 GND G21 GPIO17/TDM1TDAT/DACK1 G22 GPIO22/TDM0TCLK/DONE2/DRACK2 H2 HA20 H3 HA28 HA19 H6 TEST H7 PSDCAS/PGPL3 H8 PGTA/PUPMWAIT/PGPL4/PPBS H10 BM1/TC1/BNKSEL1 H11 ARTRY H12 AACK H13 DBB/IRQ5 H14 HTA H15 V DD H16 TT4/CS7 H17 CS4 H18 GPIO24/TDM0RSYN/IRQ14 H19 GPIO21/TDM0TSYN H20 V DD Freescale Semiconductor ...

Page 9

... PWE1/PSDDQM1/PBS1 K7 POE/PSDRAS/PGPL2 K8 IRQ2/BADDR30 K9 Reserved K10 GND K11 GND K12 GND K13 GND K14 CLKOUT MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Des. Signal Name K15 V DD K16 TT2/CS5 K17 ALE K18 CS2 K19 GND K20 A26 K21 A29 ...

Page 10

... A19 R2 HD18 R3 V DDH R4 GND R5 HD22 R6 HWBS6/HDBS6/HWBE6/HDBE6/PWE6/PSDDQM6/PBS6 R7 HWBS4/HDBS4/HWBE4/HDBE4/PWE4/PSDDQM4/PBS4 R8 TSZ1 R9 TSZ3 R10 IRQ1/GBL R11 V DD R12 V DD R13 V DD R14 TT0/HA7 R15 IRQ7/DP7/DREQ4 R16 IRQ6/DP6/DREQ3 R17 IRQ3/DP3/DREQ2/EXT_BR3 R18 TS R19 IRQ2/DP2/DACK2/EXT_DBG2 R20 A17 R21 A18 R22 A16 T2 HD17 T3 HD21 T4 HD1/DSISYNC T5 HD0/SWTE Freescale Semiconductor ...

Page 11

... U11 D14 U12 D15 U13 D17 U14 D19 U15 D22 U16 D25 U17 D26 U18 D28 U19 D31 U20 V DDH MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Des. Signal Name U21 A12 U22 A13 V2 HD3/MODCK1 V3 V DDH V4 GND ...

Page 12

... AB3 HD13 AB4 HD11 AB5 HD8 AB6 HD62/D62 AB7 HD61/D61 AB8 HD57/D57/ETHRX_ER AB9 HD56/D56/ETHRX_DV/ETHCRS_DV AB10 HD55/D55/ETHTX_ER/reserved AB11 HD53/D53 AB12 HD50/D50 AB13 HD49/D49/ETHTXD3/reserved AB14 HD48/D48/ETHTXD2/reserved AB15 HD47/D47/ETHTXD1 AB16 HD45/D45 AB17 HD44/D44 AB18 HD41/D41/ETHRXD1 AB19 HD39/D39/reserved AB20 HD36/D36/reserved AB21 A1 AB22 V DD Freescale Semiconductor ...

Page 13

... Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond the listed limits may affect device reliability or cause permanent damage. 3. Section 3.5, Thermal Considerations includes a formula for computing the chip junction temperature (T MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor CAUTION ). DD Table 2. Absolute Maximum Ratings ...

Page 14

... CCSYN V DDH Symbol Natural Convection R 26 θ θ θJB R 0.9 θJC Ψ and . V V DDH DD Value Unit 1.07 to 1.13 V 3.135 to 3.465 V –0 +0.2 V DDH –40 to 105 °C FC-PBGA × Unit 200 ft/min (1 m/s) airflow 21 °C/W 15 °C/W °C/W °C/W °C/W Freescale Semiconductor ...

Page 15

... MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601 17% DDH DDH V GND V IL GND – 0.3 V GND – 0.7 V Figure 5. Overshoot/Undershoot Voltage for V MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Table 5. DC Electrical Characteristics Symbol IHC V ILC DDH ...

Page 16

... Nominal Value DD 1 CLKIN Starts Toggling PORESET/TRST Asserted V /V Applied DD DDH and V DD DDH Typical Impedance (Ω PORESET and and CLKIN begins to toggle as V DDH V Nominal Level DDH V Nominal Level DD Time PORESET/TRST Deasserted Raised Together Freescale Semiconductor V DD are DDH rises. ...

Page 17

... The following sections include a description of clock signal characteristics. Table 7 shows the maximum frequency values for internal (Core, Reference, Bus, and DSI) and external ( frequency values are not exceeded. Characteristic Core frequency Reference frequency (REFCLK) MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor V = Nominal DDH V = Nominal DD ...

Page 18

... MHz Device Max Min Max 100 20 133.3 100 40 133.3 100 40 133.3 100 40 133.3 300 200 Min Max Unit — 0 see Table 8 MHz — 100 MHz 800 MHz 1200 MHz 1600 MHz — 200 ps — 500 ps Freescale Semiconductor 400 ...

Page 19

... Asserting initiates the power-on reset flow. PORESET and are both at their nominal levels DDH MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Table 10. Reset Sources Description Power-On Reset Hard Reset (HRESET) (PORESET) External or Internal External only (Software Watchdog or Bus Monitor) ...

Page 20

... CNFGS, DSISYNC, DSI64, RSTCONF , deassertion to define the Reset Min Max Unit 800 — ns 160 — ns 120 — ns 6.17 51.2 µs 320 320 µ µ µs 3.08 12.8 µs 3.10 12.88 µs 3 — — ns Freescale Semiconductor ...

Page 21

... REFCLK T1 T2 REFCLK T1 T2 Figure 10. Internal Tick Spacing for Memory Controller Signals MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor RSTCONF, CNFGS, DSISYNC, DSI64 CHIP_ID[0–3], BM[0–2], SWTE, MODCK[1–2] pins are sampled Host programs Reset Configuration Word MODCK[3– ...

Page 22

... MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev Table 14. AC Timing for SIU Inputs Characteristic 3 rising edge. REFCLK Ref = CLKIN at 1.1 V Units and 100/133 MHz 0.5 ns 3.1 ns 3.6 ns 3.0 ns 3.5 ns 4.4 ns 1.9 ns 4.2 ns 2.0 ns 8.2 ns 2.0 ns 7.9 ns 4.2 ns 5.5 ns 3.7 ns 4.8 ns 3.7 ns 4 REFCLK Freescale Semiconductor ...

Page 23

... To achieve maximum performance on the bus in single-master mode, disable the DBB signal by writing the SIUMCR[BDD] bit. See the SIU chapter in the MSC8113 Reference Manual for details. MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Table 15. AC Timing for SIU Outputs Electrical Characteristics ...

Page 24

... MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev REFCLK 11 PSDVAL/ABB/DBB inputs inputs 14 15 PUPMWAIT input 16 17 IRQx inputs 30 Min delay for all output pins 31 PSDVAL/TEA/TA outputs 32a/b 32c BADDR outputs 33a Data bus outputs DP outputs 33b 34 35 Figure 11. SIU Timing Diagram Freescale Semiconductor ...

Page 25

... DACK/DRACK/DONE delay after the 50% level of the REFCLK rising edge signal is synchronized with The DREQ according to the timings in Table 17. Figure 13 shows synchronous peripheral interaction. MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor skew timing. Table 16. CLKOUT Skew CLKIN CLKOUT 20 Figure 12. CLKOUT and CLKIN Signals. ...

Page 26

... REFCLK 5 + (1.5 × REFCLK 5 + (2.5 × REFCLK 1 REFCLK — 8.5 2.0 — 2.2 — 2.2 — 3.2 — — 7.4 — 6.5 — 6.5 — REFCLK 5 + (1.5 × REFCLK 5 + (2.5 × REFCLK 1 — REFCLK 1.0 — 1.7 — Freescale Semiconductor Unit ...

Page 27

... HTA released at logic 0 (DCR[HTAAD end of access; used with pull-down implementation. 4. HTA released at logic 1 (DCR[HTAAD end of access; used with pull-up implementation. Figure 14. Asynchronous Single- and Dual-Strobe Modes Read Timing Diagram MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor 100 101 112 102 103 107 ...

Page 28

... Used for single-strobe mode access. 2. Used for dual-strobe mode access. Figure 16. Asynchronous Broadcast Write Timing Diagram MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev 100 112 201 106 108 100 112 201 202 101 102 202 109 110 111 101 102 Freescale Semiconductor ...

Page 29

... HCLKIN high to HTA output active 133 HCLKIN high to HTA output valid 134 HTA output hold time 135 HCLKIN high to HTA high impedance MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Table 19. DSI Inputs in Synchronous Mode Characteristic Electrical Characteristics 1.1 V Core Expression Min Max HTC 10 ...

Page 30

... V Core Expression Min Max — (0.5 ± 0.1) × — (0.5 ± 0.1) × — 1.3 — 1.0 — 2.8 — — 10.0 2.5 — — 10.7 — 9.7 2.5 — Freescale Semiconductor Units ...

Page 31

... TDMxRCLK 303 TDMxRDAT 303 TDMxRSYN TDMxTCLK TDMxTDAT TDMxRCLK TDMxTSYN MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor 300 301 302 304 304 Figure 18. TDM Inputs Signals 300 301 302 306 305 309 Figure 19. TDM Output Signals Electrical Characteristics 308 ...

Page 32

... Figure 20. UART Input Timing 402 402 Figure 21. UART Output Timing Table 23. Timer Timing Characteristics Un Expression Min Max 16 × T 160.0 — REFCLK 10 10 400 Ref = CLKIN Unit Min Max 10.0 — ns 4.0 — ns 4.0 — ns 3.1 9.5 ns Freescale Semiconductor ...

Page 33

... ETHMDIO to ETHMDC rising edge set-up time 802 ETHMDC rising edge to ETHMDIO hold time ETHMDC ETHMDIO Figure 23. MDIO Timing Relationship to MDC MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor 500 501 502 503 Figure 22. Timer Timing Characteristics 801 802 ...

Page 34

... Figure 24. MII Mode Signal Timing Table 26. RMII Mode Signal Timing Characteristics 806 Valid 811 Valid Figure 25. RMII Mode Signal Timing Min Max 3.5 — 3.5 — 1 14.6 804 Valid 1.1 V Core Min Max 1.6 — 1.6 — 3 12.5 807 Valid Freescale Semiconductor Unit Unit ...

Page 35

... REFCLK edge to GPIO in not valid (GPIO in hold time) REFCLK 603 GPIO (Output) GPIO (Input) MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Table 27. SMII Mode Signal Timing Characteristics 808 809 Valid 810 Valid Figure 26. SMII Mode Signal Timing Table 28 ...

Page 36

... All frequencies Min Max 0.0 25 40.0 — 20.0 — 16.0 — 0.0 3.0 5.0 — 20.0 — 0.0 30.0 0.0 30.0 5.0 — 20.0 — 0.0 20.0 0.0 20.0 100.0 — 30.0 — Freescale Semiconductor Unit MHz ...

Page 37

... IL TDI TMS (Input) TDO (Output) TDO (Output) Figure 31. Test Access Port Timing Diagram TCK (Input) TRST (Input) 712 MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor 701 703 704 Input Data Valid 706 Output Data Valid 707 708 Input Data Valid ...

Page 38

... Figure 33. Core Power Supply Decoupling CLKIN / first and then bring CCSYN V going down first and DDH by more than 0 any time, including during max One 0.01 µF capacitor for every 3 core supply MSC8113 pads. High frequency capacitors (very low ESR and ESL) Freescale Semiconductor must ...

Page 39

... For any other functionality, connect the signal lines based on the multiplexed functionality. — BR must be pulled up. — EXT_BR[2–3] must be pulled up if multiplexed to the system bus functionality. MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor , and GND circuits. Pull up all unused inputs or signals that will be inputs during reset. V CCSYN V 10Ω ...

Page 40

... In other . CLKIN (if SIUMCR[INTODC] is cleared), NMI_OUT can be disconnected. Otherwise, it PPBS , RSTCONF and BM[0–2] PORESET signal. Therefore, they should PORESET signal. , and IRQxx (if not full drive) signals must GPIO10 and GPIO14 must not be connected Freescale Semiconductor are ...

Page 41

... appears to be too high, either lower the ambient temperature × (θ Core Core Operating Frequency Voltage Temperature (MHz) 1.1 V –40° to 105°C 300 400 Ordering Information Eqn with natural Eqn. 2 Order Number Lead-Free Lead-Bearing MSC8113TVT3600V MSC8113TMP3600V MSC8113TVT4800V MSC8113TMP4800V 41 ...

Page 42

... Capacitors may not be present on all devices. 8. Caution must be taken not to short capacitors or exposed metal capacitor pads on package top CBGA (Ceramic) package code: 5238. FC PBGA (Plastic) package code: 5263. 10.Pin 1 indicator can be in the form of number 1 marking or an “L” shape marking. Freescale Semiconductor ...

Page 43

... Initial public release. 1 Dec. 2008 • Added Figure 8 and associated text that was omitted from the previous revision on p. 17. • Clarified the wording of note 2 in Table 23. MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1 Freescale Semiconductor Table 31. Document Revision History Description Revision History 43 ...

Page 44

... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...

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