ADSP-21363KSWZ-1AA Analog Devices Inc, ADSP-21363KSWZ-1AA Datasheet - Page 52

• Manufacturer Part Number: ADSP-21363KSWZ-1AA
• Description: IC DSP 32BIT 333MHZ EPAD 144LQFP
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21363KSWZ-1AA

• Interface: DAI, SPI
• Clock Rate: 333MHz
• Non-volatile Memory: ROM (512 kB)
• On-chip Ram: 384kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP Exposed Pad, 144-eLQFP, 144-HLQFP
• No. Of Bits: 32 / 40
• Frequency: 333MHz
• Supply Voltage: 1.2V
• Supply Voltage Range: 1.14V To 1.26V
• Operating Temperature Range: 0°C To +70°C
• Digital Ic Case Style: QFP
• No. Of Pins: 144
• Embedded Interface Type: SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SURFACE-MOUNT DESIGN
Table 47
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 47. BGA Data for Use with Surface-Mount Design
Package
136-Ball CSP_BGA (BC-136)
is provided as an aid to PCB design. For industry stan-
1.70 MAX
Figure 48. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Package Ball Attach Type
Solder Mask Defined
DETAIL A
BALL A1
INDICATOR
TOP VIEW
12.10
12.00 SQ
11.90
* COMPLIANT WITH JEDEC STANDARDS MO-205-AE
WITH EXCEPTION TO BALL DIAMETER.
Rev. G | Page 52 of 56 | March 2011
Dimensions shown in millimeters
0.25 MIN
(BC-136)
BSC SQ
10.40
BALL DIAMETER
* 0.50
14
0.45
0.40
Package Solder Mask
Opening
0.40 mm diameter
13
12
DETAIL A
11
BOTTOM VIEW
0.80 BSC
10
9
8
7
INDEX AREA
6
A1 CORNER
5
SEATING
PLANE
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
1.31
1.21
1.10
0.12 MAX
COPLANARITY
Package Ball Pad Size
0.53 mm diameter