JD54LS164BCA National Semiconductor, JD54LS164BCA Datasheet - Page 2

• Manufacturer Part Number: JD54LS164BCA
• Manufacturer: National Semiconductor

Specifications of JD54LS164BCA

• Lead Free Status / Rohs Status: Not Compliant

_______
1/ Must withstand the added P
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
1.2.3 Case outlines. The case outlines should be as designated in MIL-STD-1835 and as follows:
1.3 Absolute maximum ratings.
1.4 Recommended operating conditions.
conditions in accordance with MIL-PRF-38535.
Supply voltage range ............................................................................. -0.5 V dc to 7.0 V dc
Input voltage range ................................................................................ -1.5 V dc at -18 mA to 5.5 V dc
Storage temperature range .................................................................... -65 to +150 C
Maximum power dissipation per register, (P
Lead temperature (soldering, 10 seconds) ............................................. 300 C
Thermal resistance, junction to case (
Junction temperature (T
Supply voltage (V
Minimum high level input voltage (V
Maximum low level input voltage (V
Case operating temperature range (T
Minimum clock pulse width:
Minimum clear pulse width:
Minimum load pulse width:
Minimum setup time at mode control:
Cases A, B, C, D, E, F, 2, and X
Outline letter
Device type 01 .................................................................................. 127 mW dc
Device type 02, 03 ............................................................................ 116 mW dc
Device type 04 .................................................................................. 110 mW dc
Device type 05 .................................................................................. 149 mW dc
Device type 06, 07 ............................................................................ 160 mW dc
Device type 08 .................................................................................. 198 mW dc
Device type 09 .................................................................................. 209 mW dc
Device type 01, 03, 05, 07, 09........................................................... 20 ns
Device type 02 .................................................................................. 18 ns
Device type 04, 06, 08....................................................................... 25 ns
Device type 01, 09 ............................................................................ 20 ns
Device type 02 .................................................................................. 15 ns
Device type 04 .................................................................................. 30 ns
Device type 05, 07 ............................................................................ 25 ns
Device type 08 .................................................................................. 30 ns
Device type 01 ................................................................................. 30 ns
Device type 03, 06 ............................................................................ 20 ns
A
B
C
D
E
F
X
2
CC
GDFP5-F14 or CDFP6-F14
GDFP4-14
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC2-N20
CQCC1-N20
) .............................................................................. 4.5 V dc minimum to 5.5 V dc maximum
J
Descriptive designator
) 2/.................................................................... 175 C
D
due to short-circuit test (e.g., I
IL
IH
) .................................................... 0.7 V dc
) ................................................... 2.0 V dc
C
) ................................................. -55 to +125 C
JC
):
D
) 1/ :
MIL-M-38510/306E
2
OS
).
Terminals
(See MIL-STD-1835)
14
14
14
14
16
16
20
20
Package style
Flat pack
Flat pack
Dual-in-line
Flat pack
Dual-in-line
Flat pack
Square leadless chip carrier
Square leadless chip carrier