5962-9316603MXA Cypress Semiconductor Corp, 5962-9316603MXA Datasheet - Page 15

• Manufacturer Part Number: 5962-9316603MXA
• Manufacturer: Cypress Semiconductor Corp

Specifications of 5962-9316603MXA

• Lead Free Status / RoHS Status: Not Compliant

DSCC FORM 2234
APR 97
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-
883.
(see 3.5 herein).
made available upon request.
before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical
parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option,
either perform delta measurements or within 24 hours after burn-in perform final electrical parameter tests, subgroups 1, 7,
and 9.
Q and V or MIL-PRF-38535, appendix A for device class M.
(original equipment), design applications, and logistics purposes.
prepared specification or drawing.
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DSCC-VA, telephone [phone].
[phone].
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
4.5 Programming procedure. The programming procedures shall be as specified by the device manufacturer and shall be
4.6 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43218-3990, or telephone
a.
b.
End-point electrical parameters shall be as specified in table IIA herein.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at
T
DEFENSE SUPPLY CENTER COLUMBUS
A
= +25°C ± 5°C, after exposure, to the subgroups specified in table IIA herein.
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
STANDARD
SIZE
A
REVISION LEVEL
B
SHEET
5962-93166
15