AD8152JBP Analog Devices Inc, AD8152JBP Datasheet - Page 3

• Manufacturer Part Number: AD8152JBP
• Description: Digital Crosspoint 34 x 34 X-Point SW 3.2Gbps 256-Pin SBGA
• Manufacturer: Analog Devices Inc

Specifications of AD8152JBP

• Package: 256SBGA
• Array Configuration: 34x34
• Number Of Arrays: 1
• Maximum Data Rate: 3.2 Gbps
• Power Supply Type: Single
• Minimum Single Supply Voltage: 2.25 V
• Maximum Single Supply Voltage: 3.63 V
• Rohs Status: RoHS non-compliant
• Function: Crosspoint Switch
• Circuit: 1 x 34:34
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 2.5 V ~ 3.3 V
• Current - Supply: 32mA
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 256-BGA Exposed Pad, 256-eBGA, 256-HBGA

ABSOLUTE MAXIMUM RATINGS
VCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7 V
VTTI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.6 V
VTTO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.6 V
Internal Power Dissipation
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.6 V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . 1.7 V
Logic Input Voltage . . . . . . VEE – 0.3 V < V
Storage Temperature Range . . . . . . . . . . . . . –65°C to +125°C
Lead Temperature Range . . . . . . . . . . . . . . . . . . . . . . . 300°C
NOTES
1
2
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8152 is
limited by the associated rise in junction temperature. The maxi-
mum safe junction temperature for plastic encapsulated devices
is determined by the glass transition temperature of the plastic,
approximately 150°C. Temporarily exceeding this limit may cause
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8152 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. A
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Specification is for the device in free air (T
AD8152 256-Ball SBGA (BP) . . . . . . . . . . . . . . . . . . 8.33 W
Model
AD8152JBP
AD8152-EVAL
2
A
= 25°C):
1
Temperature Range
0°C to 85°C
JA
IN
= 15°C/W @ still air.
< VCC + 0.6 V
ORDERING GUIDE
–3–
a shift in parametric performance due to a change in the stresses
exerted on the die by the package. Exceeding a junction tem-
perature of 175°C for an extended period can result in device
failure. To ensure proper operation, it is necessary to observe the
maximum power derating curves shown in Figure 2.
Figure 2. Maximum Power Dissipation vs. Temperature
Package Description
256-Ball SBGA (27 mm × 27 mm)
Evaluation Board
16
14
12
10
8
6
4
2
0
0
10
20
200 lfpm
AMBIENT TEMPERATURE – C
STILL AIR
30
400 lfpm
40
50
60
70
AD8152
Tj = 150 C
80
90