SI5475BDC-T1-E3 Vishay, SI5475BDC-T1-E3 Datasheet - Page 2

MOSFET Power 12V 6.0A 6.3W

SI5475BDC-T1-E3

Manufacturer Part Number
SI5475BDC-T1-E3
Description
MOSFET Power 12V 6.0A 6.3W
Manufacturer
Vishay
Datasheet

Specifications of SI5475BDC-T1-E3

Minimum Operating Temperature
- 55 C
Configuration
Single Hex Drain
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.028 Ohm @ 4.5 V
Drain-source Breakdown Voltage
12 V
Gate-source Breakdown Voltage
+/- 8 V
Continuous Drain Current
7.7 A
Power Dissipation
2500 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
Chip FET
Continuous Drain Current Id
-5.5A
On Resistance Rds(on)
31mohm
Power Dissipation Pd
2.5W
Peak Reflow Compatible (260 C)
Yes
Reel Quantity
3000
Leaded Process Compatible
Yes
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI5475BDC-T1-E3
Manufacturer:
VISHAY
Quantity:
50 000
Part Number:
SI5475BDC-T1-E3
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
SI5475BDC-T1-E3
Quantity:
2 383
Si5475BDC
Vishay Siliconix
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
SPECIFICATIONS T
Parameter
Static
Drain-Source Breakdown Voltage
V
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
DS
GS(th)
Temperature Coefficient
Temperature Coefficient
b
a
a
J
= 25 °C, unless otherwise noted
a
ΔV
Symbol
ΔV
R
V
GS(th)
I
t
t
t
t
I
I
C
V
DS(on)
C
V
GS(th)
D(on)
C
Q
Q
d(on)
d(off)
d(on)
d(off)
I
GSS
DSS
DS
g
Q
R
Q
SM
I
t
t
t
DS
oss
t
t
t
t
SD
rss
iss
S
rr
a
b
fs
gs
gd
r
r
f
f
g
rr
g
/T
/T
J
J
I
F
I
V
D
V
I
= - 6.2 A, dI/dt = 100 A/µs, T
V
D
V
DS
DS
≅ - 6.2 A, V
DS
DS
≅ - 6.2 A, V
= - 6 V, V
= - 12 V, V
V
V
V
V
= - 6 V, V
V
V
V
V
V
= - 6 V, V
V
V
GS
GS
GS
I
DS
DD
DD
GS
DS
S
DS
DS
DS
= - 6.2 A, V
= V
= - 4.5 V, I
= - 2.5 V, I
= - 1.8 V, I
Test Condition
= 0 V, I
≤ 5 V, V
= - 6 V, R
= - 6 V, R
= - 12 V, V
= - 6 V, I
= 0 V, V
I
D
T
f = 1 MHz
GEN
GS
C
= - 250 µA
GS
GEN
GS
GS
GS
= 25 °C
, I
= - 4.5 V, I
D
D
= - 4.5 V, R
= - 8 V, I
GS
= 0 V, f = 1 MHz
= 0 V, T
GS
= - 8 V, R
D
= - 250 µA
= - 250 µA
L
L
D
D
D
GS
= - 6.9 A
GS
= - 4.5 V
= 0.97 Ω
= 0.97 Ω
= - 5.6 A
= - 4.7 A
= - 1.9 A
= ± 8 V
= 0 V
= 0 V
J
D
D
= 85 °C
= - 6 A
g
J
= - 6 A
g
= 1 Ω
= 25 °C
= 1 Ω
- 0.45
Min.
- 12
- 20
0.023
0.032
0.044
1400
Typ.
15.5
- 0.9
S-83054-Rev. D, 29-Dec-08
370
260
2.5
2.1
4.0
- 7
22
26
10
38
62
70
15
65
72
45
27
15
30
9
5
Document Number: 73381
± 100
0.028
0.039
0.054
Max.
- 1.0
- 5.2
- 1.2
105
100
110
- 20
- 1
- 5
40
24
15
60
95
10
25
70
42
mV/°C
Unit
nA
µA
pF
nC
nC
ns
ns
ns
Ω
Ω
V
V
A
S
A
V

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